CI-D0XGS02S Module Datasheet

Module introduction

Overview

This module is a general-purpose, portable, low-power and high-performance speech recognition module developed for low-cost offline voice application solutions. The model is CI-D0XGS02S; CI-D01GS02S main chip is CI1301, CI-D02GS02S main chip is CI1302, CI-D03GS02S main chip is CI1303; The module pins of the three models are fully compatible. The difference is that the main chip models are different. The main chip CI1303 of CI-D03GS02S has more Flash than CI1302 and CI1301, and can support more terms, larger algorithm models and more software functions.

Figure 1 Module Block Diagram

The module has the following characteristics:

The module is small in size, 18x20mm in length and width, 3.6V-5V in working voltage, with one microphone, one speaker, two UART interfaces, and two PWM interfaces. The external interface adopts two rows of stamp holes and pin holes to facilitate the use of reflow patches and welding pins.

• The main chip of the module supports offline neural network calculation, single microphone noise reduction and enhancement, single microphone echo cancellation, 360 degree all-round pickup, which can suppress environmental noise and ensure the accuracy of speech recognition in noisy environments. Offline speech recognition using this module does not rely on the network, has small time delay, high performance, and can achieve a high recognition rate of more than 97%. The 10 meter long distance recognition can achieve a response time of up to 0.2S.
• The module can be applied to products with energy consumption level requirements and battery products.
• High reliability, industrial grade components are selected for modules.

The module can be used with the supporting function backplane. For more details about the function backplane, please click: CI-B02-MB Development Board Kit Description

The user can also select a development board with its own main chip for development. This development board does not need to purchase modules. For more information, please click: CI-D06GT01D Description of Development Board Kit

Table 1 Module Selection Table

Module selection	Less than 100 local command words	Less than 200 local command words	Less than 500 local command words
Stamp hole single microphone offline voice module	CI-D01GS02S	CI-D02GS02S	CI-D03GS02S

Introduction to module main chip

CI1301, CI1302 and CI11303 are AI chips dedicated to speech processing, which support local speech recognition, Chinese, English, Japanese and other global languages. They can be widely used in household appliances, lighting, toys, wearable devices, industry, automobiles and other product fields to achieve voice interaction and control and various intelligent voice solutions.

CI1301, CI1302&CI1303 integrate the brain neural network processor BNPU V3 and CPU core developed by Chipintelli. The main frequency of the system can reach 220MHz. SRAM up to 640KByte is built in, PMU power management unit and RC oscillator are integrated, dual channel high-performance low-power Audio Codec and multi-channel UART, IIC, IIS, PWM, GPIO, PDM and other peripheral control interfaces are integrated. The chip only needs a few peripheral devices such as resistors and capacitors to realize various hardware solutions of intelligent voice products, with high cost performance.

For more details about CI1301, CI1302&CI1303 chips, please click the following link:

☞CI1301&CI1302&CI1303 Chip Datasheet

Module Application Scenario

The module can be used as a combination of voice recognition front end+customer hardware main control board scheme, or as a single chip main control module for lamps, toys and other schemes. In application, external microphone and loudspeaker shall be connected, and the power shall be supplied by external 5V power supply.

Figure 2 Schematic diagram of the module as a speech recognition front-end application

CI-D02GS02S module supports less than 150 offline speech recognition command words, which can be applied to a variety of terminal products such as intelligent air conditioners, intelligent fans, heating tables, clothes dryers, small appliances, toys, lighting, etc.

Figure 3 Products Available for Modules

Module specifications

Physical drawing of module

Figure 4 Corresponding Location Map of Module Physical Objects and Chips

The physical module is shown in Figure 4. The speech recognition module is mounted on one side, and the main IC includes speech recognition chip (CI1302 or CI1303) and power amplifier. The voice command is input from the microphone. After speech recognition and command processing by the speech recognition IC, the feedback broadcast sound is sent to the audio power amplifier, which drives the speaker to play the sound. The maximum driving power of the power amplifier is 1.1W@8 Ω and 2W@4 Ω.

Module dimension drawing

Figure 5 Module Dimension Drawing

As shown in Figure 5, users can design the structure according to this size.

Definition of module hardware interface

Figure 6 Module Pin Diagram

This module has the following functional interfaces:

1. For the two-wire single microphone interface, please design a microphone socket or solder joint on the backplane, and add ESD devices on the microphone line. In order to ensure a good speech recognition effect, it is recommended to use a microphone with a sensitivity of - 32 ± 3dB and a signal-to-noise ratio ≥ 65dB. Please click ☞Reference microphone device for more information;
2. For the two-wire single speaker interface, please design a speaker socket or solder joint on the backplane. In order to ensure a good voice broadcast effect, it is recommended to use a speaker with a cavity. Please click on ☞Reference speaker device for more information;
3. Please connect a 100 ohm resistor in series in the serial port circuit of the backplane. If the signal is a 5V level signal, you need to add a 10k resistor on the serial port to the 5V power supply. UART0 interface can be used for module firmware upgrade. Please design corresponding pins on the backplane to facilitate subsequent upgrade; UART1 interface communicates with the main control MCU. PWM signal is mainly used for receiving and transmitting light control and infrared control signals. Refer to Figure 5 and Figure 6 for the pin sequence. All UART interfaces of this module can be configured as GPIO interfaces.

The function description of all external pins of the module is shown in Table 2:

Table 2 Comparison Table of Module Pins

Pin number	Pin name	Type	IO 5V withstand voltage	IO power on default state	Function definition
1	3.3V	P	-	-	3.3V power output, Note1
2	PWM3	IO	√	IN,T+D	1.GPIO PA5 2.IIS_ SCLK 3.PDM_ DAT 4.UART2_ TX 5. PWM channel 3
3	PWM4	IO	√	IN,T+D	1.GPIO PA6 2.IIS_ MCLK 3.PDM_ CLK 4.UART2_ RX 5. PWM channel 4
4	PWM5	IO	√	IN, T+D	External crystal input pin, Note2
5	GND	P	-	-	ground signal
6	RX0	IO	√	IN,T+U	1. GPIO PB6 2.UART0_ RX 3.IIC_ SCL 4. PWM channel 2
7	TX0	IO	√	IN,T+U	1. GPIO PB5 2.UART0_ TX 3.IIC_ SDA 4. PWM channel 1
8	5V	P	-	-	5V power supply
9	PG_ EN	IO	√	IN,T+D	1.GPIO PA4/PG_ EN.Note3 2.IIS_ SDO 3. PWM channel 2
10	TX1	IO	√	IN,T+D	1.GPIO PA2 2.IIS_ SDI 3.IIC_ SDA 4.UART1_ TX 5. PWM channel 0
11	RX1	IO	√	IN,T+D	1.GPIO PA3 2.IIS_ LRCLK 3.IIC_ SCL 4.UART1_ RX 5. PWM channel 1
12	MICL -	-	-	-	-
13	MICL+	-	-	-	Positive pole of microphone
14	SKPL -	-	-	-	Horn output
15	SKPL+	-	-	-	Horn output
16	GND	P	-	-	ground signal
17	5V	P	-	-	5V power supply

Note 1: 3.3v output current shall not exceed 10mA

Note2: The multiplexing function is not supported temporarily, and it can only be used as the input pin of the external crystal oscillator

Note3：PG_ The EN pin judges whether to program according to the level state at power on, and starts the programming function at high power level

The annotation symbols in the above table are defined as follows:

I input

O output

IO bidirectional

P power or ground

T+D tristate plus pull-down

T+U tristate plus pull-up

OUT power-on defaults to output mode

Module electrical characteristic parameters

Table 3 Table of Module Electrical Characteristics Parameters

Parameter	Condition	Minimum Value	Typical Value	Maximum Value	Unit	Remarks
Module supply voltage	/	3.6	5	5.5	V	NOTE1
Module broadcast status current (normal volume)	8 Ω 2W horn	/	70	/	mA	NOTE2
Module working current	/	/	40	/	mA	NOTE3
Monitor state current in quiet environment	5V power supply	/	35	/	mA	/
Module IO interface voltage	/	3	3.3	5	V	/

NOTE 1: 5V is the typical power supply voltage of the module. If the input voltage exceeds 5.5V, the module may be damaged

NOTE2: The maximum current of the module in the broadcast state can reach 250mA. According to the principle of double margin, it is required to provide a group of power supply with a driving capacity of 500mA for the module

NOTE3: The typical value is silent during the test. The maximum value is the recognition and broadcast state during the test

Module temperature and humidity parameters

Table 4 Temperature and Humidity Parameters

Parameter	Minimum Value	Typical Value	Maximum Value	Unit	Remarks
Module working ambient temperature	- 40	25	85	° C	/
Module storage environment temperature	- 40	25	100	° C	/
Module storage humidity	0%	/	5%	RH	/

Module application

Module backplane design reference

The use of this module requires the design of a debugging backplane or a host computer motherboard. The debugging backplane is mainly used to carry the module, provide power to the module board, place a microphone and speaker socket, and communicate with the main control circuit.

1. It is recommended to place a filter capacitor with a larger capacity at the power supply input end of the module to ensure the stability of the input 5V power supply. If the ripple of the 5V input power supply is small and the clutter is small, it can not be placed.

2. Add ESD devices near the speakers and microphone sockets to increase the electrostatic protection capability.

3. The external array pin of UART0 is reserved on the backplane to facilitate the subsequent module upgrade.

4. UART1 interface is used for master control communication and can also be reused as GPIO interface.

5. The 2-channel PWM interface can be used as the light control interface.

Module power on and start

When using the module, install the module on the backplane or the host computer motherboard, connect the speaker and microphone, and the module can be started after the 5V power supply of the module is powered on. If there is no abnormality after power on, the speaker will broadcast a startup prompt tone, and then the UART port will have print information output. The user can connect the UART port to the computer with USB serial port debugging assistant and other tools, and view the print information in the computer serial port debugging window, The print information shown in Figure 8 indicates that the module starts normally. Note that the UART interface of the module is a 3.3V level high-speed serial port, and it supports direct communication of wide voltage 5V level signals without external level conversion.

The module only needs an external 5V power supply to work normally. Both pin 8 and pin 17 of the module (the power supply is optimized from this interface) are 5V power input interfaces. The power amplifier chip also uses 5V power supply. The 5V power supply must ensure the rated power supply current of 500mA, the power supply is stable, and the ripple is less than 30mV.

Figure 8 A reference print information after the module is started

Module Default Command Word

If it is a user’s mass production module, the firmware of the command term specified by the user will be burned before leaving the factory. If not specified by the customer, the module will have its own default firmware with default command words for user testing, as shown in the following figure:

Figure 9 Module Default Command Words

Module default serial port communication protocol

The module for burning general firmware supports serial communication, which is used for communicating with the upper computer or the docking system. The protocol of the serial port is extensible, and has the following characteristics:

• Complete transmission package, including header and footer, length, verification, message type, and message serial number.
• Support variable length commands for easy expansion.
• Message type (command, notification, reply).
• Command message, configurable, reply to ACK. The notification message has no ACK.
• The message format will be the same as that of the bootloader upgrade, which is distinguished from the bootloader protocol through the header.
• The default baud rate is 9600.
• Note: Only UART0 interface is reserved for the module, and UART0 interface is the print output interface by default. If UART0 is required as the above serial port protocol interface, the code must be modified, and the modification method can be implemented by referring to the serial port protocol part of the documents in the ☞CI130X chip SDK.
• Supported commands: query the protocol version number, query the system version number, set the volume (the volume rating is defined in user_config. h), play the local broadcast, reset commands, etc. The specific protocol format is shown in the following figure:

Figure 10 Serial Port Protocol Format

Example 1:

A5 FC 07 00 A0 91 18 01 55 E0 01 00 00 1B 9B 02 FB is resolved as follows:,

A5 FC：head

07 00: Valid data is 7byte

A0: This is the command word information

91: The command number is 0x91 (this data content is command word data)

18: Packet serial number, the 0x08th outgoing data of this serial port, which is continuously accumulated

01 55 E0 01 00 00: unique data of the current command word

1B: Command word threshold

9B 02: Cumulative Sum

FB: End data

Note: If only command words and thresholds are concerned in the application, only 7 valid data in the blue part can be concerned.

Example 2:

A5 FC 02 00 A3 9A 17 00 B1 05 02 FB is resolved as follows:

A5 FC ：head

02 00: Valid data 2byte

A3: currently notification data

9A: The command number is 0X9A (the data content this time is the voice module content change)

17: This serial port sends data for the 0x07th time, and the value is continuously accumulated

00 B1: Valid data. (This data indicates entering the wake-up state)

05 02: Cumulative Sum

FB: End data

Note: This data is notification data, and the user can choose to use this information according to the situation.

For more content analysis data, please refer to the serial port protocol part in ☞CI130X chip SDK. The following figure is a reference screenshot of protocol data:

Figure 11 Reference screenshot of serial port protocol data

Software development

If the default firmware of the module cannot meet the user’s needs, the user can develop the software by himself and modify the command words, broadcast voice, serial communication protocol and other functions of the module.

The software development process mainly includes the following steps:

• SDK development kit material download
• Model making (language model+acoustic model)
• Speech synthesis
• The command word information table is associated with the audio file
• Firmware packaging

For detailed development process, please click ☞CI130X chip SDK.

Firmware burning

Preparation before burning

Before burning the module, users need to prepare the following items:

• Modules to be burned
• USB to serial port tool
• Firmware burning tool (pack_update_tool. exe)
• Firmware information (files in *. bin format)
• Microphone and loudspeaker matched with corresponding interface of backplane/upper computer
• Several DuPont lines

Figure 12 Items to be prepared for firmware burning

Hardware connection and burning

As an example of the USB to serial tool shown in the above figure, the power, ground and serial port transceiver pins of the USB to serial port need to be connected with the corresponding pins of the module before burning (note that the RXD and TXD of the USB to serial port correspond to the UART0_TX and UART0_RX of the module respectively).

Open the firmware burning tool (this tool can find PACK_UPDATE_TOOL.exe in the CI130X_SDK tools directory of the SDK development kit), select the corresponding model according to the chip, click the firmware upgrade button, select the prepared firmware file, and confirm the serial port number assigned by the computer to the USB serial port tool. After the module is powered on, it can enter the firmware upgrade mode and start downloading firmware. If the computer cannot recognize the USB to serial port tool, please install the corresponding driver first. (The mold is upgraded on the base plate)

Figure 14 Schematic Diagram of Firmware Burning Tool

Function test after burning

After the firmware burning is completed, it is recommended to perform a functional test on the module to verify whether the firmware burning is successful. Before the function test, the module to be tested needs to first connect the microphone and loudspeaker, power on to confirm whether there is a power on broadcast sound, and use the wake-up word and command word to test whether there is normal wake-up and recognition. If they can work normally, the module functions normally and the burning is successful; Otherwise, the burning fails, and further investigation is required.

Possible problems and solutions in use

This chapter lists the problems that may be encountered in the use of some modules and the corresponding solutions.

• The module cannot burn and update firmware. After the above problems occur, please check the following operation points:

1. Whether the serial port pins are connected correctly, whether the TX and RX are connected reversely, whether the USB to serial port tool drive at the computer end is normal, and whether the PC burning tool has selected the correct serial port number;
2. Whether the power supply is short circuited, causing chip damage.
3. If the above two points are checked to be correct, the module cannot be burned. You need to use a multimeter to measure whether the module power supply voltages of 5V, 3.3V and 1.1V are correct. Refer to the following figure for each hardware measurement point. If a voltage problem is found, it is considered as a module hardware failure, please replace the module or repair the module hardware. If there is no problem in the above inspection, please contact our technical support personnel for help.

Figure 15 Distribution of Module Test Points

• The module is burned and there is no broadcast after power on. After the above problems occur, please check the following operation points:

1. Confirm whether the burning firmware matches the board;
2. Confirm that the horn is correctly connected and the power supply is normal; The oscilloscope is used to measure the voice output test point of the main chip. If there is no output, check whether the firmware is correct. If there is output, check whether the power amplifier on the module is abnormal during welding. If the power amplifier is abnormal, replace it before testing. The measuring points are shown in the figure below. If there is no problem in the above inspection, please contact our technical support personnel for help.

Figure 16 Module voice output measurement points

• After the module is burned, the command word is announced but not recognized after power on:

1. Check whether the connection between the microphone and the socket is intact;
2. Check whether the positive and negative pole directions of the microphone are consistent with the markings on the module board and are not inserted reversely;
3. Use a multimeter to measure whether the MICBIAS pin corresponding to the main chip is about 2.8V, and use an oscilloscope to measure whether the microphone input pin has an input voice waveform (the voltage of each oscilloscope cell is adjusted to the 100mv gear). If the signal is normal, consider whether the firmware is correct, and if the signal is abnormal, observe whether the board hardware has physical damage. The measuring points are shown in the figure below. If there is no problem in the above inspection, please contact our technical support personnel for help.

Figure 17 Module microphone signal test point

Other application precautions

• Because the CI1302&CI1303 chip has a high ESD level and the module is designed to facilitate user expansion, the module is not designed with ESD devices. For products with high ESD requirements, ESD devices can be added to the backplane at microphone, speaker and power socket locations. Users are recommended to wear anti-static bracelets or anti-static gloves and finger cots during inspection and welding to ensure the quality and reliability of products.

• Please note that the microphone, speaker and power supply serial ports cannot be connected incorrectly.

• The user can use the USB to serial port tool to debug the developed software. During debugging, add the serial port printing command to the corresponding position in the SDK software, generate firmware after compilation and burn it, and then debug and verify.

• All IOs of this module board are of typical 3.3V level, and also support 5V withstand voltage.

• When designing the module backplane or host computer motherboard, a capacitor with a capacity not less than 100uF shall be placed at the 5V power input of the module, and the microphone wiring shall be as short as possible; The microphone wiring shall be shielded. The SPK wiring shall be as short and thick as possible, and there shall be no other wiring leaps in the wiring area.

• The warpage of the control base plate shall not be greater than 0.5% to prevent poor module welding.

Manufacturing Guide, Storage and Packaging Ordering Information

Production Storage Guide

1. The packaging module of Chipintelli stamp port must be mounted by SMT mounting machine (except for the pin mode), and the mounting must be completed within 24 hours after unpacking, or the vacuum packaging shall be carried out again.

2. The storage conditions of Chipintelli stamp port packaging module are as follows:

• The vacuum moisture-proof bag must be stored in a constant temperature and humidity warehouse with a temperature of 25 ± 5 ℃ and a humidity of 65% ± 10% RH.
• The vacuum moisture-proof bag is equipped with a humidity indicator card, as shown in the figure below:

Figure 18 Humidity Indicator Card

3. Modules delivered from Chipintelli need baking. Humidity indicator card and baking conditions are as follows:

• When unpacking, if the humidity indicator card reads 30%, 40% and 50% of the color rings are blue, the module needs to be continuously baked for 2 hours
• When unpacking, if the humidity indicator card reads that 30% of the color ring turns pink, the module needs to be continuously baked for 4 hours
• When unpacking, if the humidity indicator card reads that 30% and 40% of the color rings become pink, the module needs to be continuously baked for 6 hours
• If the humidity indicator card reads that 30%, 40% and 50% of the color rings turn pink when unpacking, the module needs to be baked for 12 hours continuously

4. Baking parameters are as follows:

• Baking temperature: 125 ± 5 ℃
• Alarm temperature setting: 130 ℃
• SMT patch can be carried out after cooling under natural conditions<36 ℃
• Drying times: 1 time
• If there is no welding more than 12 hours after baking, please bake again

5. If the unpacking time is more than 3 months, it is prohibited to use the SMT process to weld this batch of modules, because this PCB is a gold deposition process. After more than 3 months, the bonding pad is seriously oxidized, which is very likely to lead to false soldering and missing soldering when SMT is mounted.

6. Before SMT mounting, please conduct ESD (electrostatic discharge, electrostatic discharge) protection on the module. Please wear static gloves and static bracelets during operation.

7. In order to ensure the qualification rate of reflow soldering, all products should be visually inspected and AOI tested to ensure the correctness of furnace temperature control, device adsorption mode and placement mode

Recommended furnace temperature curve

Fig. 19 Furnace Temperature Curve

Packaging Ordering Information

Table 5 Module Batch Ordering and Packaging Information

Product model	Packaging method	Number of modules per pallet	Number of modules per package	Number of modules per box
CI-D01GS02S CI-D02GS02S CI-D03GS02S	Tray+electrostatic bag+carton	140pcs	15 trays totaling 2100pcs	3 bags totaling 6300pcs

Procurement and technical support

If the user wants to purchase our product samples, please click on ☞Batch Purchase to obtain more information.

If you want to obtain technical support, please log in to ☞Chipintelli Speech AI Development Platform.