CI-E0XGT02S Module Datasheet¶
Module introduction¶
Overview¶
CI-E0XGT02S is an intelligent voice AIOT module developed by Chipintelli. The module core uses a new generation of high-performance neural network intelligent voice chip CI230X developed by Chipintelli, and integrates the brain neural network processor BNPU V3 and CPU core developed by Chipintelli, as well as the Combo function of Wi Fi and BLE in a single chip. The main frequency of the system can reach 220MHz, with built-in large capacity SRAM, integrated PMU power management unit, dual channel high-performance low-power Audio Codec and multi-channel UART, IIC, IIS, PWM, GPIO and other peripheral control interfaces, and integrated PA/LNA/TRX Switch on the chip.
The CI-E0XGT02S module supports the standard IEEE 802.11 b/g/n protocol and BLE 5.1 wireless communication protocol, and supports TCP/UDP HTTP/HTTPS/PING/MQTT and other protocol stacks. All kinds of intelligent speech offline&online product hardware solutions can be realized with a small amount of external devices such as resistors and capacitors, with high cost performance.
CI230X uses industrial design standards and has high environmental reliability. The operating temperature range of the chip is - 40 ° C to+85 ° C. It meets the MSL3 humidity sensitivity level, the 4KV contact discharge test standard of IEC 61000-4-2, the FCC electromagnetic compatibility standard, and the ROHS and REACH environmental protection standards.
CI230X adopts the third-generation BNPU technology of Chipintelli, which can support DNN TDNN RNN and other neural networks and convolution operations, support voice recognition, voiceprint recognition, voice enhancement, voice detection and other functions, and has strong echo cancellation and environmental noise suppression capabilities. The speech recognition effect is superior to other speech chips. The chip solution also supports Chinese, English, Japanese and other global languages, and can be widely used in household appliances, lighting, toys, wearables, industry, automobiles and other product fields to achieve voice interaction and control and various intelligent voice solutions.
At present, CI230X is divided into CI2305 and CI2306 chips. These two chip pins are completely compatible, only the built-in Flash capacity is different. The CI2305 is built-in with 4MB Flash, and the CI2306 is built-in with 6MB Flash. Due to its small Flash capacity, CI2305 only supports offline speech recognition and AIOT type applications connected by IOT. CI2306 can support offline&online speech recognition, and supports more neural network models with larger capacity and more broadcasts, which has better noise reduction effect.
The CI-E0XGT02S module has two models: CI-E05GT02S and CI-E06GT02S. The pins of these two models are completely compatible, only the main chip is different. CI-E05GT02S uses CI2305 chip, and CI-E06GT02S uses CI2306 chip. The selection table is as follows:
| Module model | Main chip | Flash capacity | Applications |
|---|---|---|---|
| CI-E05GT02S | CI2305 | 4MB | AIOT |
| CI-E06GT02S | CI2306 | 6MB | Offline&online speech recognition |
Characteristics¶
◆ Single chip IEEE 802.11 b/g/n Wi Fi SOC module, supporting AIOT and offline&online applications.
◆ Built in PA/LNA/TRX switch.
◆ Support STA/AP/STA+AP mode.
◆ Built in protocol stack: TCP/UDP/HTTP/HTTPS/PING/MQTT, TLS support for TCP/UDP.
◆ Support Bluetooth LE 5.1, long range (125Kbps, 500Kbps) and high transmission rate (2Mbps).
◆ The hardware BNPU is used for neural network operation, and the BNPU is upgraded to V3 version to enhance AI voice processing function, support DNN TDNN RNN and other neural networks and convolution operations, and support voice recognition, voiceprint recognition, voice enhancement, voice detection and other functions.
◆ Built in 32-bit high-performance CPU, support up to 220MHz operating frequency, 32-bit single cycle multiplier, and support DSP expansion acceleration.
◆ Built in large capacity SRAM, built-in 512bit eFuse, and built-in 4/6MB Flash.
◆ Built in high-performance low-power Audio Codec module, supporting dual ADC sampling and single DAC playback; Support the Automatic Level Control (ALC) function; Support 8kHz/16kHz/24kHz/32kHz/44.1kHz/48kHz sampling rate; Support one IIS audio extension channel; It supports PDM interface, and can dock single or two digital MEMS microphones.
◆ Multiple high-performance LDOs are built in, and only one power supply device is needed for the periphery to work. It supports 5V power supply direct input. The minimum power supply range supports 3.6V input, and the maximum power supply range supports 5.5V input.
◆ Built in AES-128/AES-192/AES-256 hardware encryption and decryption, and built-in true random number generator.
◆ One 12bit SAR ADC input channel is supported, and the sampling frequency can reach 1MHz.
◆ It supports 2-way UART interface and 3M baud rate at most; It supports 1-way IIC interface and can be extended by external IIC devices; It supports 6-way PWM interface, and the lamp control and motor applications are convenient for direct drive; Built in 4 groups of 32 bit timers; One set of independent watchdog (IWDG) is built in; Built in 1 set of window watchdog (WWDG).
◆ It supports 18 high-speed GPIOs and can be configured with interrupt function; Some GPIOs support direct communication of wide voltage 5V level signals without external level conversion.
◆ Provide complete software development package, application scheme examples and voice development platform online firmware production and other functions. For details, please visit:( https://aiplatform.chipintelli.com )
◆ Support UART upgrade and firmware protection.
◆ Good EMC design, support FCC standard, internal ESD enhanced design, and pass 4KV contact discharge test.
◆ Adopt environment-friendly materials and support ROHS and REACH tests.
◆ The module is small in size, and the packaging form is SMD-31. The size is 24mm long, 16mm wide, and 3mm high (including the shielding cover).
◆ Ambient working temperature: - 40 ℃ to 85 ℃.
Main parameters¶
| Module model | CI-E0XGT02S |
|---|---|
| Packaging | SMD-31 |
| Size | 24 * 16 * 3.0mm (dimensional tolerance ± 0.2) |
| Antenna | On board PCB antenna |
| Frequency band range | 2412 ~ 2484 Mhz |
Power supply range |
5V: power supply voltage 3.6~5.5V, power supply current ≥ 500mA 3.3V: power supply voltage 2.6~3.6V, power supply current ≥ 1A |
| Support interfaces | UART、GPIO、ADC、PWM、I2C、I2S、PDM、MIC、HPOUT |
Number of GPIO |
18 GPIOs: PE2, PE3, PE9, PA2, PA3, PA4, PA5, PA6, PA7, PB0, PB1, PB2, PB3, PB4, PB5, PB6, PF4, PF5 |
| Serial port rate | The maximum support is 3000000 bps, and the default is 921600 bps |
| Bluetooth | BLE 5.1 |
| Security encryption | WEP/WPA-PSK/WPA2-PSK |
Flash |
CI-E05GT02S：4MB CI-E06GT02S：6MB |
| Operating temperature | -40℃ ~ 85℃ |
| Storage environment | -40℃ ~ 100℃,≤ 5% RH |
Electrical parameters¶
Electrical characteristics¶
| Symbol | Parameter | Minimum | Typical | Maximum | Unit |
|---|---|---|---|---|---|
| 5V_ IN | PMU input pin voltage generally 5V |
3.6 | 5 | 5.5 | V |
| VDD33 | Wi Fi power supply voltage | 2.6 | 3.3 | 3.6 | V |
| VIH | Input high voltage 3.0V ≤ VDD33 ≤ 3.6V |
VDD33-0.6 | / | VDD33+0.3 | V |
| VIL | Input low voltage 3.0V ≤ VDD33 ≤ 3.6V |
/ | / | 0.6 | V |
| VOL | Output low voltage @ IOL=12mA | / | / | 0.4 | V |
| VOH | Output high voltage @ IOL=20mA | VDD33-0.5 | VDD33 | VDD33+0.3 | V |
| I3.3V | Working current of 3.3V power supply of module | 90 | / | 500 | mA |
| I5V | Working current of 5V power supply of module | 55 | / | 250 | mA |
WiFi Features¶
Supported frequency band¶
| Parameter | Min | Typ | Max | Unit |
|---|---|---|---|---|
| Receive frequency rang 2.4Ghz | 2412 | / | 2484 | Mhz |
Receiving characteristics¶
| Parameter | Condition | Min | Typ | Max | Unit |
|---|---|---|---|---|---|
| Sensitivity | |||||
| 11b,1M | FER < 8%,1024 bytes | / | -94 | / | dBm |
| 11b,11M | FER < 8%,1024 bytes | / | -87 | / | dBm |
| 11g,6M | FER < 10%,1024 bytes | / | -90 | / | dBm |
| 11g,54M | FER < 10%,1024 bytes | / | -74 | / | dBm |
| 11n,MCS0 | FER < 10%,1024 bytes | / | -90 | / | dBm |
| 11n,MCS7 | FER < 10%,1024 bytes | / | -71 | / | dBm |
| Maximum input level | |||||
| 11b | FER < 8%,1024 bytes |
/ | 4 | / | dBm |
| 11g | FER < 10%,1024 bytes |
/ | -10 | / | dBm |
| 11n | FER < 10%,1024 bytes |
/ | -10 | / | dBm |
| power consumption | |||||
| 11b | / |
/ | 80 | / | mA |
| 11g | / |
/ | 82 | / | mA |
| 11n | / |
/ | 82 | / | mA |
Note: The above power consumption data is the current measured when VDD33 is 3.3V.
Emission characteristic¶
| Parameter | Condition | Min | Typ | Max | Unit |
|---|---|---|---|---|---|
| Output power | |||||
| 11b,1M DSSS | Maximum Burst power | / | 18 | / | dBm |
| 11g,54M OFDM | Maximum Burst power | / | 16 | / | dBm |
| 11n,MCS7 | Maximum Burst power | / | 14 | / | dBm |
| Power consumption | |||||
| 11b | 100% Duty Cycle @ 17dBm |
/ | 320 | / | mA |
| 11g | 100% Duty Cycle @ 14dBm |
/ | 290 | / | mA |
| 11n | 100% Duty Cycle @ 13dBm |
/ | 270 | / | mA |
Note: The above power consumption data is the current measured when VDD33 is 3.3V.
Module specifications¶
External dimensions¶
As shown in Figure 2, the user can design the structure according to this size, in mm.
Interface definition¶
The function description of all external pins of the module is shown in Table 7:
Table 7 Comparison Table of Module Pins
| Pin number | Pin name | Type | IO 5V Withstand voltage | Power on default Status recognition | Pin reuse Function description |
|---|---|---|---|---|---|
| 1 | RSTn | I | - | - | Reset pin |
| 2 | PE2 | IO | - | IN,PU | 1.GPIO PE2 2.WIFI firmware download TX |
| 3 | PE3 | IO | - | IN,PU | 1.GPIO PE3 2.WIFI firmware download RX |
| 4 | PE9 | IO | - | IN,PU | 1.GPIO PE9 2.WIFI BOOTMODE1 |
| 5 | AIN2 | IO | - | IN,T+U | 1.GPIO PC4（power on default state） 2.IIC_SCL 3.PWM0 4.PDM_CLK 5.SAR ADC input channel 2 |
| 6 | MICL+ | I | - | - | Left Microphone P input |
| 7 | MICL- | I | - | - | Left Microphone N input |
| 8 | MICBIAS | O | - | - | Microphone bias output |
| 9 | MICR- | I | - | - | Right Microphone N input |
| 10 | MICR+ | I | - | - | Right Microphone P input |
| 11 | HPOUTL- | O | - | - | DAC output |
| 12 | AGND | P | - | - | Analog ground |
| 13 | 5V_IN | P | - | - | 5V power input, external 4.7uf and 0.1uF capacitors |
| 14 | GND | P | - | - | GND |
| 15 | VDD33 | P | - | - | 3.3V power input, external 4.7uf and 0.1uF capacitors |
| 16 | PA2 | IO | √ | IN,T+D | 1.GPIO PA2 (default state of power on) 2.IIS_SDI 3.IIC_SDA 4.PWM0 |
| 17 | PA3 | IO | √ | IN,T+D | 1.GPIO PA3（Power-on default state） 2.IIS_LRCLK 3.IIC_SCL 4.PWM1 |
| 18 | PA4 | IO | √ | IN,T+U | 1.GPIO PA4 (power on default state)/PG_ EN (judge whether to program according to the level state at power on, and start the programming function at high power level)2.IIS_SDO 3.PWM2 |
| 19 | PA5 | IO | √ | IN,T+D | 1.GPIO PA5 (default state of power on) 2.IIS_SCLK 3.PDM_DAT 4.UART2_TX 5.PWM3 |
| 20 | PA6 | IO | √ | IN,T+D | 1.GPIO PA6 (default state of power on) 2.IIS_MCLK 3.PDM_CLK 4.UART2_RX 5.PWM4 |
| 21 | PA7 | IO | √ | IN,T+D | 1.GPIO PA7 (default state of power on) 2.PWM0 3.EXT_INT[0] |
| 22 | PB0 | IO | √ | IN,T+D | 1.GPIO PB0 (default state of power on) 2.PWM1 3.EXT_INT[1] |
| 23 | PB1 | IO | √ | IN,T+D | 1.GPIO PB1 (default state of power on) 2.PWM2 3.UART2_TX |
| 24 | PB2 | IO | √ | IN,T+D | 1.GPIO PB2 (default state of power on) 2.PWM3 3.UART2_RX |
| 25 | PB3 | IO | √ | IN,T+D | 1.GPIO PB3 (default state of power on) 2.PWM4 3.IIC_SDA |
| 26 | PB4 | IO | √ | IN,T+D | 1.GPIO PB4（Power-on default state） 2.PWM5 3.IIC_SCL |
| 27 | PB5 | IO | √ | IN,T+U | 1.GPIO PB4 (default state of power on) 2.UART0_TX 3.IIC_SDA 4.PWM1 |
| 28 | PB6 | IO | √ | IN,T+U | 1.GPIO PB5 (default state of power on) 2.UART0_RX 3.IIC_SCL 4.PWM2 |
| 29 | PF4 | IO | - | IN,PU | GPIO PF4 |
| 30 | PF5 | IO | - | IN,PU | GPIO PF5 |
| 31 | GND | P | - | - | GND |
Note 1: All IO support drive capacity can be configured, and the up and down resistance can be configured
Note 2: The first function of all pins with multiplexing function is the default configuration function of this pin when it is powered on
Note 3: When the module is powered on, it detects that there is an upgrade signal on PB5/PB6, and it can automatically enter the upgrade mode
Note 4: There is a heat dissipation pad at the bottom of the module package, which should be grounded during application design
Some symbols in the above table are described as follows:
I input
O output
IO bidirectional
P power or ground
T+D tristate plus pull-down
T+U tristate plus pull-up
OUT power-on defaults to output mode
Module schematic diagram¶
Circuit design reference¶
Power supply¶
◆ Module VIN_ 5V is the 5V power supply input pin, and the ripple requirement is<100mV. 5V is a typical power supply voltage, and the module may be damaged if the input voltage exceeds 5.5V. The maximum 5V current can reach 250mA (including external 4 Ω/3W speakers) when the module is broadcasting. In principle, it is required to provide a group of power supply with a driving capacity of 500mA for the module according to the double margin. At the same time, a 4.7R 0805 Package resistor must be connected in series to the module VIN_ 5V pin and TVS inside the module form a surge protection circuit, which cannot be deleted
◆ Module VDD33 is a 3.3V power supply input pin, which needs separate power supply. It is recommended to use DCDC for power supply, such as RY3408 DCDC chip. Users can also choose DCDC chip according to the requirements of the scheme. The current drive capacity of DCDC chip must be ＞ 1A
◆ If there are requirements for FCC/CE and other EMI certification tests, VIN_ For 5V and VDD33, it is recommended to reserve 100pF grounding capacitance and place it close to the module pin
◆ If the ripple of input power supply is large, other ripple improvement measures such as electrolytic capacitor must be added
◆ The power supply and ground wire routing shall be as wide as possible, and it is recommended to be ＞ 15 mil
Microphone¶
◆ The module supports single wheat or double wheat input
◆ The coupling capacitor is integrated inside the module, and the external circuit is unnecessary
◆ ESD devices shall be placed at MIC input port to ensure ESD performance
◆ If there are requirements for FCC/CE and other EMI certification tests, MIC signal lines need to reserve 100pF grounding capacitance
◆ The ESD shall be placed close to the input socket, and the wiring shall first pass through the ESD and then through the grounding capacitor
◆ If there is wiring from ESD to signal terminal, the wiring width shall be at least 20mil
◆ At the connection between ESD and DGND, more than 3 grounding vias are required to strengthen grounding
◆ The MIC signal line shall be routed as short as possible. It is prohibited to change layers when routing in the same layer
◆ Other signal lines shall be routed away from MIC lines
◆ Both sides of MIC wiring are covered with AGND, and the lower part of the line area is covered with AGND network copper
◆ The MIC input socket shall be marked with the left and right channel silk screen and the positive and negative input end silk screen of each channel according to the circuit connection relationship, and measures shall be taken to prevent the positive and negative insertion from being reversed
Power amplifier¶
◆ Determine the model of power amplifier chip (digital or analog) according to the requirements of the application scheme, and design according to the corresponding design reference circuit
◆ Class AB analog power amplifier is used in this reference design, and the actual application scheme determines whether to retain or cancel the ESD device according to the ESD performance requirements of the scheme
◆ Whether MUTE lines need to place pull-up/pull-down resistors is subject to the definition of power amplifier mute state (if the power amplifier is defined as low-level mute, pull-down resistors need to be placed)
◆ In this reference design, it is recommended to use PA4 for mute control, with built-in pull-up resistor. If the power amplifier is defined as high-level mute, it is unnecessary to place additional pull-up resistor
◆ This reference design recommends that AGND and HPOUTL pins be connected to the power amplifier by differential wiring to avoid abnormal noise caused by audio interference
AEC¶
◆ The module supports single wheat+AEC application and double wheat+AEC application
◆ Single microphone+AEC scheme: the microphone is connected to the left channel, and the output signal of the power amplifier SPKL+or SPKL - is transmitted back to MICP after being divided by the voltage dividing circuit_ R.
◆ Dual microphone+AEC scheme: The microphone is connected to the left and right channels. The output signals of the power amplifier, SPKL+and SPKL -, need to be divided by the voltage divider circuit, then sent to the external ADC circuit. After ADC conversion, they are returned to the module I2S interface
◆ ADC chip (ES7243E) shall be placed as close to the module as possible
◆ Punch 2 * 2 vias on the grounding pad below the ADC chip (ES7243E) to ensure good grounding
◆ The I2S wiring shall be as short as possible to avoid interference signals. It is recommended that the I2S signal line be completely grounded
◆ The AGND and DGND networks of the ADC chip (ES7243E) are connected at a single point on the B-side of the chip bottom or near the chip
UART¶
◆ The module reserves two high-speed serial ports: UART0 and UART2. UART0 is the voice firmware download serial port by default; UART2 is the communication serial port connected with other systems
◆ If there are requirements for FCC/CE and other EMI certification tests, 100pF grounding capacitance and 100 Ω series resistance shall be reserved on the UART line
◆ If there are ESD/EFT performance test requirements, ESD devices shall be reserved on UART lines. When UART0 is used for communication, TVS junction capacitance must be<25 pF to meet the upgrade requirements; When UART2 is used for communication, when the baud rate is 9600, the TVS junction capacitance is required to be<400pF; When the baud rate is 921600, the TVS junction capacitance is required to be<50pF
◆ If the UART needs to connect to the 5V level communication system, a 5V pull-up resistor should be placed on the UART line, and the software should be set to open drain mode
◆ PE2 and PE3 are serial ports for downloading Wi Fi firmware, and PF4 and PF5 are serial ports for printing Wi Fi Log logs, which are not recommended for other functions
◆ The function description of the module serial port is shown in Table 8:
| Serial port | IO 5V withstand voltage | Function description |
|---|---|---|
| UART0 | √ | Voice firmware download, default baud rate 2000000；Voice Log log printing, default baud rate 921600 |
| UART2 | √ | Communication with other systems |
| PE2、PE3 | × | Wi Fi firmware download, the default baud rate is 2000000 |
| PF4、PF5 | × | Wi Fi Log printing, default baud rate 921600 |
Upgrade enable circuit¶
◆ PA4 is the voice firmware upgrade enabled detection pin: enter the upgrade mode at high level; Enter normal startup mode at low level. Built in pull-up resistor, the default is to detect and upgrade after power on
◆ Test points TP12 and TP13 are placed on PCB BOTTOM layer for automatic upgrade function
◆ PE9 is the Wi Fi firmware upgrade enabling pin detection: enter the upgrade mode at low level; Enter normal startup mode at high level. Built in pull-up resistor, which is powered on and started normally by default
◆ The module upgrade enabling function is described in Table 9:
| Enable Feet | Configuration | Description | |
|---|---|---|---|
| PA4 |
R6 | R16 | |
| NC | NC | By default, the upgrade signal is first detected during power on detection. The startup time is about 850ms, which is applicable to applications that do not require high startup time |
|
| 2.2K | 2.2K | By default, the system will enter the normal startup mode when it is powered on. The startup time is about 350ms, which is suitable for applications with quick startup requirements If the production line requires firmware burning, you can short circuit TP12 and TP13 to detect the upgrade signal and burn the firmware after power on |
|
| PE9 |
0 | Wi Fi firmware upgrade enable detection pin: enter upgrade mode at low level |
|
| 1 | The Wi Fi firmware upgrade enables the detection of pins: enter the normal startup mode at a high level Built in pull-up resistor, it starts normally when powered on by default |
||
Module package design size¶
◆ It is recommended to design PCB packaging according to the figure below, with the unit of mm. When designing pads, do not increase pads or shrink pads to avoid short circuit which may affect the use of modules
Module layout requirements¶
◆ During module assembly, the antenna area should be as far away from metal components and strong interference components as possible to avoid affecting the antenna performance
◆ During module assembly, the antenna area should be as far away from audio devices as possible, such as audio power amplifier, to avoid audio noise
◆ It is recommended to install the module on the motherboard in the following two ways
◆ Scheme 1: Place the module near the edge of the main board, and the antenna area of the module (including the entire antenna clearance area on the module) must be completely beyond the metal area of the main board PCB. The module antenna area shall extend at least 6mm beyond the mainboard. The preferred position is that the antenna feed point is close to the corner of the main board
◆ Scheme II: The module antenna area does not extend out of the main board, and the main board in the corresponding area around the antenna is hollowed out. The left and right sides shall be hollowed at least 15mm
Module application¶
Module power on and start¶
The minimum system has been integrated in the module. When using the module, just connect the speaker and microphone, and connect 5V and 3.3V power supplies, the module will start automatically. When power on is normal, the horn will broadcast a prompt audio, and print information will appear on UART0 port. The user can connect UART0 to the computer using USB serial port debugging assistant and other tools. If the print information is seen in the serial port debugging software in the computer, it indicates that the module is successfully started
It should be noted that UART0 is the voice firmware download serial port and voice log log print serial port; PE2 and PE3 are serial ports for downloading Wi Fi firmware, and PF4 and PF5 are serial ports for printing Wi Fi Log logs.
Firmware burning¶
Preparation before burning¶
Before burning the module, users need to prepare the following items:
- Modules to be burned
- USB to serial port tool
- Firmware burning tool (pack_update_tool. exe)
- Firmware information (files in *. bin format)
- Microphone with 2.0mm pitch
- 2.5mm pitch horn
- Several DuPont lines
Hardware connection and burning¶
Use the USB TYPE-C adapter cable to connect the module and the computer. If there is no backplane as shown in the figure below, the USB to serial port tool is required, as shown in the USB to serial port tool above. Before burning, connect the power, ground, serial port transceiver pins of the USB to serial port with the corresponding pins of the module. Note that the RXD and TXD of the USB to serial port correspond to the UART0 of the module respectively_ TX and UART0_ RX, PE3 and PE2
The wiring diagram of module burning is shown in the figure below:
Voice firmware burning¶
◆ Short circuit the pins at PB5-TX0 and PB6-RX0 with jumper cap
◆ Switch the onboard serial port switch to the “VOICE” position
◆ Open the firmware burning tool, select the voice firmware burning tag, select the corresponding model according to the chip, click the firmware upgrade button, select the prepared firmware file, and find the serial port number assigned to the USB serial port tool by the corresponding computer. After the preparations are ready, turn on the power switch to automatically enter the programming mode (PA4 internal pull-up), and start downloading firmware. After the download is completed, the progress bar displays 100%
◆ If the USB serial port tool cannot be recognized on the computer, please install the corresponding driver on the computer
Wi Fi firmware burning¶
◆ Short circuit the pins at PE2, PE3 and PE9 with jumper cap
◆ Switch the onboard serial port switch to the “Wi Fi” position
◆ Open the firmware burning tool, select the WIFI firmware burning label, set the download mode, firmware file and baud rate in the edit menu, and then confirm. Find the serial port number assigned to the USB serial port tool by the corresponding computer
◆ Press and hold the BOOT button. (Pull down PE9)
◆ Turn on the power switch, click the Start Download button, and enter the Wi Fi firmware download mode. After the download is completed, the progress bar displays 100%
◆ If the USB serial port tool cannot be recognized on the computer, please install the corresponding driver on the computer
Module test¶
Voice function test¶
After the firmware is successfully burned, it is recommended to perform a functional test on the module to verify whether the firmware is successfully burned. During the function test, plug the microphone and loudspeaker into the module to be tested, power on and observe whether it can be normally powered on and broadcast, and use the wake-up word and command word to test whether it can be normally wakened up and recognized. If it can work normally, the module functions normally and the burning is successful; Otherwise, the burning fails, and further investigation is required.
Possible problems and solutions in use¶
This chapter lists the problems that may be encountered in the use of some modules and the corresponding solutions
- The module cannot burn and update the firmware. Please check the following operation points:
◆ Whether PA4 pin has been pulled up and PE9 pin has been pulled down before the module is powered on
◆ Whether the serial port pins are connected correctly, whether the TX and RX are connected reversely, whether the USB to serial port tool drive at the computer end is normal, and whether the PC burning tool has selected the correct serial port number
◆ If the above two points are correct, the module cannot be burned. Use a multimeter to measure whether the power supply voltage of the module is 5V, 3.3V and 1.1V, and use an oscilloscope to measure whether the crystal starts vibrating. Refer to the figure below for each hardware measurement point. If there is a voltage or crystal problem, consider it as a module hardware fault, and replace the module or repair the module hardware. If there is no problem in the above inspection, please contact our technical support personnel for help
- The module is burned and there is no broadcast after power on. Please check the following operation points:
◆ Confirm whether the burning firmware matches the board
◆ Make sure the horn is correctly connected and the power supply is normal
◆ Check the power amplifier mute pin level, and confirm whether the power amplifier mute pin status matches the power amplifier mute definition
◆ Use an oscilloscope to measure the voice output test point of the main chip. If there is no output, check whether the firmware is correct. If there is output, check whether the power amplifier components on the module are welded abnormally. If the power amplifier is abnormal, replace it and test again. The measuring points are shown in the figure below. If there is no problem in the above inspection, please contact our technical support personnel for help
- After the module is burned, there is a broadcast but the command word is not recognized after power on. Please check the following operation points:
◆ Check whether the connection between the microphone and the socket is in good condition
◆ Check whether the positive and negative directions of the microphone are consistent with the markings on the module board and whether they are inserted reversely
◆ Use a multimeter to measure whether the MICBIAS pin corresponding to the main chip has a voltage of about 2.8V, and use an oscilloscope to measure whether the microphone input pin has an input voice waveform (the voltage of each grid of the oscilloscope is adjusted to the 100mv gear). If the signal is normal, consider whether the firmware is correct, and if the signal is abnormal, observe whether the board hardware has physical damage. The measuring points are shown in the figure below. If there is no problem in the above inspection, please contact our technical support personnel for help
Other application precautions¶
◆ Because the CI230X chip has a high ESD level and the module is designed to facilitate user expansion, only ESD devices are designed at the power supply position on the module, and ESD devices can be added to products with high ESD requirements. Please reserve ESD protective devices at the corresponding backplane connector to ensure the quality and reliability of the product. Users are recommended to wear anti-static bracelets or anti-static gloves and finger cots during inspection and welding
◆ The following networks need to be added with test points and placed on the BOTTOM layer of the main board PCB for mass production automation testing: VCC_ 5V、VCC3V3、GND、TX0、RX0、TX2、RX2、MIC+、MIC-、SPK+、SPK-、PG_ EN.
◆ The test points on the main board and module BOTTOM can be hollowed out for RF testing
◆ A small resistance, such as 22R, can be connected in series to the communication interface
◆ Use the recommended packaging design PCB to avoid poor soldering caused by too much or too little tin
◆ When using, pay attention to the microphone, speaker and power supply, and the serial port cannot be connected incorrectly
◆ Pay attention to prevent short circuit at the back test point
◆ Note that this module must be powered by 5V and 3.3V at the same time, and voice function and Wi Fi function can work normally
◆ The user can use the USB to serial port tool to debug the developed software. During debugging, add the serial port printing command to the corresponding position in the SDK software, generate firmware after compilation and burn it, so as to conduct debugging verification
◆ All IOs of this module board are typical 3.3V level, and some IOs also support 5V withstand voltage
◆ When designing the module backplane or host computer motherboard, a capacitor with a capacity not less than 100uF shall be placed at the 5V power input of the module; The microphone wiring shall be as short as possible, and the wiring shall be shielded; SPK routing shall be as short and thick as possible, and there shall be no other routing leaps in the routing area
◆ Control the warping degree of the bottom plate to be no more than 0.5% to prevent poor module welding
Manufacturing Guide, Storage and Packaging Ordering Information¶
Production Storage Guide¶
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The packaging module of Chipintelli stamp hole must be mounted by SMT mounting machine, and the mounting must be completed within 24 hours after unpacking, otherwise vacuum packaging shall be carried out again.
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The storage conditions of Chipintelli stamp hole packaging module are as follows:
- The vacuum moisture-proof bag must be stored in a constant temperature and humidity warehouse with a temperature of 25 ± 5 ℃ and a humidity of 65% ± 10% RH.
- The vacuum moisture-proof bag is equipped with a humidity indicator card, as shown in the figure below:
- Modules delivered from Chipintelli need baking. Humidity indicator card and baking conditions are as follows:
- When unpacking, if 30%, 40% and 50% of the reading value of the humidity indicator card are blue, the module needs to be continuously baked for 2 hours.
- When unpacking, if the humidity indicator card reads that 30% of the color ring turns pink, the module needs to be continuously baked for 4 hours.
- When unpacking, if the humidity indicator card reads that 30% and 40% of the color rings become pink, the module needs to be continuously baked for 6 hours.
- If the humidity indicator card reads that 30%, 40% and 50% of the color rings become pink when unpacking, the module needs to be baked for 12 hours.
- Baking parameters are as follows:
- Baking temperature: 125 ± 5 ℃
- Alarm temperature setting: 130 ℃
- SMT patch can be carried out after cooling under natural conditions<36 ℃
- Drying times: 1 time
- If there is no welding more than 12 hours after baking, please bake again
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If the unpacking time is more than 3 months, it is prohibited to use the SMT process to weld this batch of modules, because this PCB is a gold deposition process. After more than 3 months, the bonding pad is seriously oxidized, which is very likely to lead to false soldering and missing soldering when SMT is mounted.
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Before SMT mounting, please conduct ESD (electrostatic discharge, electrostatic discharge) protection on the module. Please wear static gloves and static bracelets during operation.
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In order to ensure the qualification rate of reflow soldering, all products should be visually inspected and AOI tested to ensure the correctness of furnace temperature control, device adsorption mode and placement mode
Recommended furnace temperature curve¶
Packaging Ordering Information¶
| Product model | Packaging method | Number of modules per pallet | Number of modules per package | Number of modules per box |
|---|---|---|---|---|
| CI-E05GT02S | Tray+electrostatic bag+carton | 140pcs | 15 trays totaling 2100pcs | 3 bags totaling 6300pcs |
| CI-E06GT02S | Tray+electrostatic bag+carton | 140pcs | 15 trays totaling 2100pcs | 3 bags totaling 6300pcs |
Procurement and technical support¶
If the user wants to purchase our product samples, please click on ☞Batch Purchase to obtain more information.
If you want to obtain technical support, please log in to ☞Chipintelli Speech AI Development Platform.