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Chip Overview

CI1306 is a new generation of high-performance neural network intelligent voice chip developed by Chipintelli. It integrates the brain neural network processor BNPU V3 and CPU core developed by Chipintelli. The main frequency of the system can reach 240MHz. It is built with SRAM up to 640KByte, PMU power management unit and RC oscillator, dual channel high-performance low-power Audio Codec and multi-channel UART, IIC, IIS, PWM, GPIO, PDM and other peripheral control interfaces. The chip only needs a few peripheral devices such as resistors and capacitors to realize various hardware solutions of intelligent voice products, with high cost performance.

CI1306 uses industrial design standards and has high environmental reliability. The chip’s operating temperature range is between - 40 ° C and+85 ° C. It meets the MSL3 humidity sensitivity level, the 4K contact discharge test standard of IEC 61000-4-2, the FCC electromagnetic compatibility standard, and the ROHS and REACH environmental protection standards.

CI1306 adopts the third-generation BNPU technology of Chipintelli, which supports DNN TDNN RNN CNN and other neural networks and parallel vector operations, and can realize voice recognition, voiceprint recognition, end NLP, command word self-learning, voice detection and deep learning noise reduction, and has strong echo cancellation and environmental noise suppression capabilities. The chip solution also supports Chinese, English, Japanese and other global languages, and can be widely used in household appliances, lighting, toys, wearables, industry, automobiles and other product fields to achieve voice interaction and control and various intelligent voice solutions.

Please click ☞CI1306 Chip Datasheet to download the complete chip Datasheet.

Table G-1 Chip Information

Chip model FLASH capacity RAM capacity Package information
CI1306 4MByte 640KByte QFN40(5mm* 5mm* 0.85mm)

Some applicable product fields of CI1306:

  • Smart home appliances

  • Smart toys

  • Intelligent lighting

  • Intelligent wearable

  • Intelligent industry

  • Smart car

CI1306应用框图

Figure G-1 Chip Application Block Diagram

The chip features are as follows:

  • Neural network processor BNPU V3

    • It adopts third-generation hardware BNPU technology, supports DNN TDNN RNN CNN and other neural networks and parallel vector operations, and can realize voice recognition, voiceprint recognition, end NLP, command word self-learning, voice detection and deep learning noise reduction

  • CPU

    • 32-bit high-performance CPU, with operating frequency up to 240MHz
    • 32 bit single cycle multiplier, supporting DSP expansion acceleration

  • Memory

    • Built in 640KB SRAM
    • Built in 512bit eFuse
    • Built in 4MB Flash

  • Audio interface

    • Built in high-performance low-power Audio Codec module, supporting dual ADC sampling and single DAC playback
    • Support Automatic Level Control (ALC) function
    • Support 8kHz/16kHz/24kHz/32kHz/44.1kHz/48kHz sampling rate
    • Support one IIS audio extension channel
    • Support one way PDM interface, which can interface with single or two digital MEMS microphones

  • Power management unit PMU

    • Built in 3 high-performance LDOs, no additional power supply chip is needed, and only a few resistance capacitance devices are needed in the periphery
    • Support 5V power supply direct input, minimum power supply range support 3.6V input, maximum support 5.5V input

  • Clock

    • Built in RC oscillator, also supports external crystal oscillator; Developers can choose to use built-in RC or external crystal as the clock source of the chip according to different application schemes

  • SAR ADC

    • Four 12bit SAR ADC input channels, sampling frequency up to 1MHz

    • ADC IO can be functionally multiplexed with digital GPIO

  • Peripherals and timers

    • 3-way UART interface, supporting up to 3M baud rate
    • One IIC interface, which can be extended by external IIC devices
    • 6-way PWM interface, lamp control and motor applications can be directly driven
    • Built in 4 groups of 32 bit timers
    • Built in 1 set of independent watchdog (IWDG)
    • Built in 1 set of window watchdog (WWDG)

  • GPIO

    • It supports 26 GPIO ports and can be used as the master IC
    • Except for the four GPIO ports corresponding to the PD, other GPIO ports can be configured with interrupt function. All GPIO ports support up and down configuration
    • Some GPIOs support direct communication of wide voltage 5V level signals without external level conversion, but require external resistance pulled up to 5V

  • Software development support

    • It provides complete software development package, application scheme examples and online firmware production of voice development platform. For details, please visit: https://aiplatform.chipintelli.com

  • Firmware burning and protection

    • Support UART upgrade and firmware protection

  • EMC and ESD

    • Good EMC design, supporting FCC standards

    • Internal ESD enhanced design can pass 4KV contact discharge test

  • ROHS and REACH

    • Adopt environment-friendly materials and support ROHS and REACH tests

  • Packaging and operating temperature range

    • Packaging form: QFN40, the size is 5mm long, 5mm wide and 0.85mm high

    • Working ambient temperature: - 40 ℃ to 85 ℃