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Chip Overview

CI1301, CI1302, and CI1303 are the latest generation of high-performance neural network voice chips developed by Chipintelli. These chips integrate Chipintelli’s self-developed Brain Neural Processing Unit (BNPU) V3 and CPU cores, with a system frequency of up to 220MHz and built-in SRAM of up to 640KB. They feature an integrated PMU power management unit, RC oscillator, dual-channel high-performance low-power Audio Codec, and multiple peripheral interfaces including UART, IIC, IIS, PWM, GPIO, and PDM. With minimal external components required, these chips offer an excellent cost-performance ratio for various intelligent voice product solutions.

Designed to industrial standards, the CI1301, CI1302, and CI1303 chips ensure high environmental reliability with an operating temperature range of -40°C to +85°C. They comply with MSL3 moisture sensitivity level, meet IEC 61000-4-2 4KV contact discharge test standards, and adhere to FCC EMC standards, as well as ROHS and REACH environmental protection standards.

Leveraging Chipintelli’s V3 BNPU technology, these chips support neural networks including DNN, TDNN, RNN, and CNN, along with parallel vector operations. They enable advanced features such as speech recognition, voiceprint recognition, command word self-learning, voice activity detection, and deep learning noise reduction, delivering robust echo cancellation and environmental noise suppression capabilities. Supporting multiple global languages including Chinese, English, and Japanese, these chips are ideal for a wide range of applications such as home appliances, lighting, toys, wearable devices, industrial equipment, and automotive products, enabling voice interaction, control, and various intelligent voice solutions.

Documentation

Please click☞CI1301 Chip Datasheet ☞CI1302 Chip Datasheet and ☞CI1303 Chip Datasheet to download the complete chip Datasheet.

Table G-1 Chip Information

Chip model FLASH capacity RAM capacity Package information
CI1301 1MByte 640KByte SSOP24 (8.6mm×6.0mm×1.64mm)
CI1302 2MByte 640KByte SSOP24 (8.6mm×6.0mm×1.64mm)
CI1303 4MByte 640KByte SSOP24 (8.6mm×6.0mm×1.64mm)

Note: The built-in flash of CI1303 and CI1302 chip are larger, which can support a larger capacity of neural network model and process more recognition and voice prompts. It has better noise suppression effect and supports the OTA upgrade function. CI1301 chip does not support the OTA upgrade function temporarily. It supports either voice print recognition or voice recognition. If you want to support both voice print recognition and voice recognition, please use CI1303 or CI1302 chip

Application Fields

  • Smart home appliances
  • Smart toys
  • Intelligent lighting
  • Intelligent wearable
  • Intelligent industry
  • Smart car

CI1303应用框图

Figure G-1 CI1303 Chip Application Diagram

Chip Key Features

  • Neural network processor BNPU V3

    • It adopts BNPU V3 technology, supports DNN TDNN RNN CNN and other neural networks and parallel vector operations, and can realize voice recognition, voiceprint recognition, command word self-learning, voice detection, deep learning noise reduction and other functions

  • CPU

    • 32-bit high-performance CPU, with the maximum operating frequency of 220MHz
    • 32 bit single cycle multiplier, supporting DSP extension acceleration

  • Memory

    • Built in 640KB SRAM
    • Built in 512bit eFuse
    • Built in 1-4MB Flash

  • Audio interface

    • Built in high-performance low-power Audio Codec module, supporting dual ADC sampling and single DAC playback
    • Support Automatic Level Control (ALC) function
    • Support 8kHz/16kHz/24kHz/32kHz/44.1kHz/48kHz sampling rate
    • Support one IIS audio extension channel
    • Support one way PDM interface, which can interface with single or two digital MEMS microphones

  • Power management unit(PMU)

    • Built in 3 high-performance LDOs, no additional power supply chip is needed, and only a few resistance capacitance devices are needed in the periphery
    • Support 5V power supply direct input, minimum power supply range support 3.6V input, maximum support 5.5V input

  • Clock

    • Built in RC oscillator, also supports external crystal oscillator; Developers can choose to use built-in RC or external crystal as the clock source of the chip according to different application solutions

  • SAR ADC

    • One 12bit SAR ADC input channel, sampling frequency up to 1MHz
    • ADC IO can be functionally multiplexed with digital GPIO

  • Peripherals and timers

    • 3-way UART interface, supporting up to 3M baud rate
    • One IIC interface, which can be extended by external IIC devices
    • 6-way PWM interface, lamp control and motor applications can be directly driven
    • Built in 4 groups of 32 bit timers
    • Built in 1 set of independent watchdog (IWDG)
    • Built in 1 set of window watchdog (WWDG)

  • GPIO

    • It supports 10 GPIO ports and can be used as the master IC
    • Interrupt function can be configured for each GPIO port, and all GPIO ports support up and down configuration
    • Some GPIOs support direct communication of wide voltage 5V level signals without external level conversion, but require external resistance pulled up to 5V

  • Software development support

    • It provides complete software development package, application solution examples and online firmware production of voice development platform. For details, please visit: https://aiplatform.Chipintelli.com

  • Firmware flashing and protection

    • Support UART upgrade and firmware protection

  • EMC and ESD

    • Enhanced internal ESD protection circuitry
    • Passes 4kV contact discharge per IEC 61000-4-2

  • ROHS and REACH

    • Adopt environment-friendly materials and support ROHS and REACH tests

  • Packaging and operating temperature range

    • Packaging: SSOP24 (8.6mm × 6.0mm × 1.64mm)
    • Working ambient temperature: - 40 ℃ to 85 ℃