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Chip Overview

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Chip Overview

The CI231X series represents Chipintelli’s latest generation of high-performance neural network voice chips. These chips integrate the company’s self-developed Brain Neural Processing Unit (BNPU) V3 and CPU cores, achieving a system frequency of up to 240MHz with 640KB of built-in SRAM. They feature an integrated PMU power management unit, dual-channel high-performance low-power Audio Codec, and multiple peripheral interfaces including UART, IIC, PWM, GPIO, and PDM. Additionally, they incorporate a 2.400-2.483GHz ISM band wireless transceiver with embedded baseband communication protocols. With minimal external components (just a few resistors and capacitors), these chips provide a cost-effective wireless system solution for various intelligent voice products.

Designed to industrial standards, the CI231X series ensures high environmental reliability with an operating temperature range of -40°C to +85°C. The chips comply with MSL3 moisture sensitivity level, meet IEC 61000-4-2 4KV contact discharge test standards, and adhere to FCC EMC standards, as well as ROHS and REACH environmental protection standards.

Leveraging Chipintelli’s V3 BNPU technology, the CI231X series supports neural networks including DNN, TDNN, RNN, and CNN, along with parallel vector operations. They enable advanced features such as speech recognition, voiceprint recognition, command word self-learning, voice activity detection, and deep learning noise reduction, delivering robust echo cancellation and environmental noise suppression capabilities. Supporting multiple global languages including Chinese, English, and Japanese, these chips are ideal for a wide range of applications such as home appliances, lighting, toys, wearable devices, industrial equipment, and automotive products, enabling voice interaction, control, and various intelligent voice solutions.

Documentation

For complete technical specifications, please download the appropriate datasheet: - CI2311 Datasheet - CI2312 Datasheet

Table G-1 Chip Information

Chip model FLASH capacity RAM capacity Package information
CI2311 1MByte 640KByte TSSOP24(7.8mm*6.4mm*1.2mm)
CI2312 2MByte 640KByte TSSOP24(7.8mm*6.4mm*1.2mm)

Note: with a larger built-in Flash capacity, CI2312 can support a larger neural network model and more voice prompts and other functions, provide better noise reduction effect. CI2311 and CI2312 chips do not support OTA upgrade. With limited Flash capacity, those chips can only support one of the following functions: voice print recognition or speech recognition.

Key Application Fields

  • Smart home appliances
  • Smart toys
  • Intelligent lighting
  • Intelligent wearable
  • Intelligent industry
  • Smart car

CI231系列芯片应用框图

Figure G-1 Chip Application Block Diagram

Chip Features

  • Wireless features

    • speechsensitivity of 1Mbps mode can reach -90dbm; Maximum output power +8dBm
    • With hardware auto answer and auto retransmission functions
    • Fast channel switching, can achieve multi-channel frequency modulation algorithm
    • Supports BLE broadcasting

  • Neural network processor BNPU V3

    • Adopt 3-generation hardware BNPU technology, support DNN\TDNN\RNN\CNN and other neural networks and parallel vector operations, can achieve speech recognition, voice print recognition, command word self-learning, speech detection and deep learning noise reduction functions

  • CPU

  • 32-bit high-performance core
  • Operating frequency up to 240MHz
  • Integrated 32-bit single-cycle multiplier

  • DSP acceleration support

  • Memory

    • Built-in 640KB SRAM
    • Built-in 512bit eFuse
    • Built-in Flash up to 2MB

  • Audio interface

    • Built-in high performance low power Audio Codec module, support dual-channel ADC sampling and single-channel DAC playback
    • Supports Automatic Level Control (ALC)
    • support 8 kHz / 16 kHz / 24 kHz / 32 kHz, 44.1 kHz, 48 kHz sampling rate
    • Supports one PDM interface for connecting to one or two digital MEMS microphones

  • Power management unit PMU

    • Built-in 3 high-performance Ldos, no need to add a power chip, only a small amount of peripheral resistance container
    • Support 5V power supply direct input, the minimum power supply range supports 3.6V input, the maximum power supply range supports 5.5V input

  • Clock

  • 16MHz external crystal oscillator

  • SAR ADC

    • 2 12bit SAR ADC input channels, sampling frequency up to 1MHz
    • ADC IO multiplexes functions with digital GPIO

  • Peripherals and timers

    • 2-channel UART ports, supporting a maximum of 3 baud rate
    • 1-channel IIC interface, which can be expanded by external IIC devices
    • 3-channel PWM interface, light control and motor applications can be driven directly
    • Built-in four groups of 32-bit timers
    • Built-in 1 Independent watchdog (IWDG)
    • Built-in 1 set of window watchdog (WWDG)

  • GPIO

    • Supports seven GPIO ports and can be used as the main control IC
    • Each GPIO port can be configured with the interrupt function
    • Some GPIOs support direct communication of wide-voltage 5V level signals without external level conversion but require external resistance pulled to 5V

  • Software development support

    • provide complete software development kit, application example and speech development platform online production firmware, and other functions, for details, please visit:https://aiplatform.Chipintelli.com

  • Firmware flashing and protection

    • Supports UART upgrade and firmware protection

  • EMC and ESD

    • Good EMC design, support FCC standards
    • Internal ESD enhanced design, can pass 4KV contact discharge test

  • ROHS and REACH

    • The use of environmentally friendly materials to support ROHS and REACH testing

  • Package and operating temperature range

    • Package form：TSSOP24，the size is 7.8mm long, 6.4mm wide, 1.2mm high
    • Working environment temperature:-40℃ to 85℃