Electrical Characteristics¶
The electrical characteristic parameters of CI230X are shown in the following table.
Table E-1 Electrical Parameters¶
| Symbol | Description | Minimum | Typical | Maximum | Unit |
|---|---|---|---|---|---|
| 5V_IN | PMU input pin voltage (generally 5V) | 3.6 | 5 | 5.5 | V |
| VDD33 | Wi-Fi power supply voltage | 2.6 | 3.3 | 3.6 | V |
| VIH | Input high voltage (3.0V ≤ VDD33 ≤ 3.6V) | VDD33-0.6 | / | VDD33+0.3 | V |
| VIL | Input low voltage (3.0V ≤ VDD33 ≤ 3.6V) | / | / | 0.6 | V |
| VOL | Output low voltage @ IOL=12mA | / | / | 0.4 | V |
| VOH | Output high voltage @ IOL=20mA | VDD33-0.5 | VDD33 | VDD33+0.3 | V |
| I3.3V | Working current of 3.3V power supply | 90 | / | 500 | mA |
| I5V | Working current of 5V power supply | 55 | / | 250 | mA |
Wi-Fi Features¶
Supported Frequency Band¶
Table E-2 Frequency Band Table¶
| Parameter | Min | Typ | Max | Unit |
|---|---|---|---|---|
| Receive frequency 2.4Ghz | 2412 | / | 2484 | MHz |
| ### Receiving Characteristics |
Table E-3 Receiving Characteristics¶
| Parameter | Condition | Min | Typ | Max | Unit |
|---|---|---|---|---|---|
| Sensitivity | |||||
| 11b,1M | FER < 8%, 1024 bytes | / | -94 | / | dBm |
| 11b,11M | FER < 8%, 1024 bytes | / | -87 | / | dBm |
| 11g,6M | FER < 10%, 1024 bytes | / | -90 | / | dBm |
| 11g,54M | FER < 10%, 1024 bytes | / | -74 | / | dBm |
| 11n,MCS0 | FER < 10%, 1024 bytes | / | -90 | / | dBm |
| 11n,MCS7 | FER < 10%, 1024 bytes | / | -71 | / | dBm |
| Maximum input level | |||||
| 11b | FER < 8%, 1024 bytes | / | 4 | / | dBm |
| 11g | FER < 10%, 1024 bytes | / | -10 | / | dBm |
| 11n | FER < 10%, 1024 bytes | / | -10 | / | dBm |
| Power consumption | |||||
| 11b | / | / | 80 | / | mA |
| 11g | / | / | 82 | / | mA |
| 11n | / | / | 82 | / | mA |
Note: The above power consumption data is the current measured when VDDA33 is 3.3V
Emission Characteristics¶
Table E-4 Emission Characteristics¶
| Parameter | Condition | Min | Typ | Max | Unit |
|---|---|---|---|---|---|
| Output power | |||||
| 11b,1M DSSS | Maximum Burst power | / | 18 | / | dBm |
| 11g,54M OFDM | Maximum Burst power | / | 16 | / | dBm |
| 11n,MCS7 | Maximum Burst power | / | 14 | / | dBm |
| Power consumption | |||||
| 11b | 100% Duty Cycle @ 17dBm | / | 320 | / | mA |
| 11g | 100% Duty Cycle @ 14dBm | / | 290 | / | mA |
| 11n | 100% Duty Cycle @ 13dBm | / | 270 | / | mA |
Note: The above power consumption data is the current measured when VDDA33 is 3.3V
If the application solutions requires high-precision clock, or UART communication with MCU is required, and the ambient temperature range exceeds - 10 to 70 ℃, it is recommended to use an external crystal oscillator as the clock source, and the working ambient temperature can meet or exceed the industrial standard specifications. If the internal RC oscillator is used as the clock source, the UART communication baud rate must be less than or equal to 115200bps, and the total deviation from the UART baud rate of the MCU shall not exceed 4% to ensure good communication. If the working environment temperature is - 10 to 70 ℃, the baud rate deviation of the matched MCU UART must not exceed ± 1.5% in this temperature zone. If the working environment temperature is - 20 to 85 ℃, the baud rate deviation of the MCU UART must not exceed ± 1% in this temperature zone
If the MCU is designed without a crystal oscillator, communication errors must be minimized. Chipintelli offers a UART baud rate auto-adaptation solution, which requires adding a handshake command to the UART protocol. The MCU must respond according to protocol requirements within 50 ms of receiving this handshake command. With this auto-adaptation mechanism in place, the product can reliably operate in environments ranging from -20°C to 85°C
When CI230X is conducting SMT welding, please control the temperature and time of the reflow. The temperature curve of a SMT welding is shown in the following figure.
Figure E-1: CI230X SMT welding temperature curve
The chip has a Moisture Sensitivity Level (MSL) of 3. Please store it according to MSL3 conditions before use. If the storage time after opening the package exceeds the MSL3 limit, baking is required before SMT soldering.