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Chip Overview

The CI1311 and CI1312 are next-generation high-performance neural network voice chips developed by Chipintelli. These chips integrate the company’s self-developed Brain Neural Processing Unit (BNPU) V3 and CPU cores, achieving a system frequency of up to 220MHz with 640KB of built-in SRAM. They feature an integrated PMU power management unit, RC oscillator, single-channel high-performance low-power Audio Codec, and multiple peripheral interfaces including UART, IIC, PWM, and GPIO. With minimal external components (just a few resistors and capacitors), these chips enable various intelligent voice product solutions with excellent cost-performance ratio.

Designed to industrial standards, the CI1311 and CI1312 chips ensure high environmental reliability with an operating temperature range of -20°C to +85°C. They comply with MSL3 moisture sensitivity level, meet IEC 61000-4-2 4KV contact discharge test standards, and adhere to FCC EMC standards, as well as ROHS and REACH environmental protection standards.

Leveraging Chipintelli’s V3 BNPU technology, these chips support neural networks including DNN, TDNN, RNN, and CNN, along with parallel vector operations. They enable advanced features such as speech recognition, voiceprint recognition, command word self-learning, voice activity detection, and deep learning noise reduction, delivering robust echo cancellation and environmental noise suppression capabilities. Supporting multiple global languages including Chinese, English, and Japanese, these chips are ideal for a wide range of applications such as home appliances, lighting, toys, wearable devices, industrial equipment, and automotive products, enabling voice interaction, control, and various intelligent voice solutions. Note: Due to Flash memory limitations, the CI1311 and CI1312 cannot support both voiceprint recognition and speech recognition simultaneously. For applications requiring both features, please use the CI1303 or CI1306 chips instead.

Please click ☞CI1312 Chip Datasheet to download the complete chip Datasheet.

Table G-1 Chip Information

Chip model FLASH capacity RAM capacity Package information
CI1312 2MB 640KB SOP16(9.9mmx6.0mmx1.7mm)

Key Application Fields

  • Smart home appliances

  • Smart toys

  • Intelligent lighting

  • Intelligent wearable

CI1312应用框图

Figure G-1 CI1312 Chip Application Block Diagram

Chip Features

  • Neural network processor BNPU V3

    • It adopts BNPU V3 technology, supports DNN TDNN RNN CNN and other neural networks and parallel vector operations, and can realize voice recognition, voiceprint recognition, command word self-learning, voice detection, deep learning noise reduction and other functions

  • CPU

    • 32-bit high-performance CPU, with the maximum operating frequency of 220MHz
    • 32 bit single cycle multiplier, supporting DSP expansion acceleration

  • Memory

    • Built in 640KB SRAM
    • Built in 512bit eFuse
    • Built in 2MB Flash

  • Audio interface

    • Built in high-performance low-power Audio Codec module, supporting single ADC sampling and single DAC playback
    • Support Automatic Level Control (ALC) function Support 8kHz/16kHz/24kHz/32kHz/44.1kHz/48kHz sampling rate

  • Power management unit PMU

    • Built in 3 high-performance LDOs, no additional power supply chip is needed, and only a few resistance capacitance devices are needed in the periphery
    • Support 5V power supply direct input, minimum power supply range support 3.6V input, maximum support 5.5V input

  • Clock

    • Built in RC oscillator

  • Peripherals and timers

    • Two UART interfaces can support up to 3M baud rate
    • One IIC interface, which can be extended by external IIC devices
    • 3-way PWM interface, lamp control and motor applications can be directly driven
    • Built in 4 groups of 32 bit timers
    • Built in 1 set of independent watchdog (IWDG)
    • Built in 1 set of window watchdog (WWDG)

  • GPIO

    • It supports 5 GPIO ports and can be used as the master IC
    • Each GPIO port can be configured with interrupt function, and supports up and down configuration
    • Each GPIO supports direct communication of wide voltage 5V level signals without external level conversion, but requires external resistance pulled up to 5V

  • Software development support

    • It provides complete software development package, application solution examples and online firmware production of voice development platform. For details, please visit: https://aiplatform.Chipintelli.com

  • Firmware flashing and protection

    • Support UART upgrade and firmware protection

  • EMC and ESD

    • Good EMC design, supporting FCC standards
    • Internal ESD enhanced design can pass 4KV contact discharge test

  • ROHS and REACH

    • Adopt environment-friendly materials and support ROHS and REACH tests

  • Packaging and operating temperature range

    • Packaging form: SOP16, size: 9.9mmx6.0mmx1.7mm
    • Working ambient temperature: - 20 ℃ to 85 ℃