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Chip Overview

CI1312 is a new generation of high-performance neural network intelligent speech chip developed by Chipintelli. It integrates the brain neural network processor BNPU V3 and CPU core developed by Chipintelli. The main frequency of the system can reach 220MHz, with SRAM up to 640KByte built-in, PMU power management unit and RC oscillator integrated, single channel high-performance low-power Audio Codec and multi-channel UART, IIC, PWM, GPIO and other peripheral control interfaces. The chip only needs a few peripheral devices such as resistors and capacitors to realize various hardware solutions of intelligent voice products, with high cost performance.

CI1312 uses industrial design standards and has high environmental reliability. The chip’s operating temperature range is between - 20 ° C and+85 ° C. It meets the MSL3 humidity sensitivity level, the 4K contact discharge test standard of IEC 61000-4-2, the FCC electromagnetic compatibility standard, and the ROHS and REACH environmental protection standards.

CI1312 adopts the third-generation BNPU technology of Chipintelli, which supports DNN TDNN RNN CNN and other neural networks and parallel vector operations, and can realize voice recognition, voiceprint recognition, command word self-learning, voice detection and deep learning noise reduction, and has strong echo cancellation and environmental noise suppression capabilities. The chip solution also supports Chinese, English, Japanese and other global languages, and can be widely used in household appliances, lighting, toys, wearables, industry, automobiles and other product fields to achieve voice interaction and control and various intelligent voice solutions. CI1312 does not support speech recognition if it supports voiceprint recognition due to the Flash capacity. If you want to support both voiceprint recognition and speech recognition, please use CI1303 or CI1306 chip.

Please click ☞CI1312 Chip Datasheet to download the complete chip Datasheet.

Table G-1 Chip Information

Chip model FLASH capacity RAM capacity Package information
CI1312 2MByte 640KByte SOP16(9.9mm*6.0mm*1.7mm)

Some applicable product fields of CI1312:

  • Smart home appliances

  • Smart toys

  • Intelligent lighting

  • Intelligent wearable

CI1312应用框图

Figure G-1 CI1312 Chip Application Block Diagram

The chip features are as follows:

  • Neural network processor BNPU V3

    • It adopts third-generation hardware BNPU technology, supports DNN TDNN RNN CNN and other neural networks and parallel vector operations, and can realize voice recognition, voiceprint recognition, command word self-learning, voice detection, deep learning noise reduction and other functions

  • CPU

    • 32-bit high-performance CPU, with the maximum operating frequency of 220MHz
    • 32 bit single cycle multiplier, supporting DSP expansion acceleration

  • Memory

    • Built in 640KB SRAM
    • Built in 512bit eFuse
    • Built in 2MB Flash

  • Audio interface

    • Built in high-performance low-power Audio Codec module, supporting single ADC sampling and single DAC playback
    • Support Automatic Level Control (ALC) function Support 8kHz/16kHz/24kHz/32kHz/44.1kHz/48kHz sampling rate

  • Power management unit PMU

    • Built in 3 high-performance LDOs, no additional power supply chip is needed, and only a few resistance capacitance devices are needed in the periphery
    • Support 5V power supply direct input, minimum power supply range support 3.6V input, maximum support 5.5V input

  • Clock

    • Built in RC oscillator

  • Peripherals and timers

    • Two UART interfaces can support up to 3M baud rate
    • One IIC interface, which can be extended by external IIC devices
    • 3-way PWM interface, lamp control and motor applications can be directly driven
    • Built in 4 groups of 32 bit timers
    • Built in 1 set of independent watchdog (IWDG)
    • Built in 1 set of window watchdog (WWDG)

  • GPIO

    • It supports 5 GPIO ports and can be used as the master IC
    • Each GPIO port can be configured with interrupt function, and supports up and down configuration
    • Each GPIO supports direct communication of wide voltage 5V level signals without external level conversion, but requires external resistance pulled up to 5V

  • Software development support

    • It provides complete software development package, application scheme examples and online firmware production of voice development platform. For details, please visit: https://aiplatform.chipintelli.com

  • Firmware burning and protection

    • Support UART upgrade and firmware protection

  • EMC and ESD

    • Good EMC design, supporting FCC standards
    • Internal ESD enhanced design can pass 4KV contact discharge test

  • ROHS and REACH

    • Adopt environment-friendly materials and support ROHS and REACH tests

  • Packaging and operating temperature range

    • Packaging form: SOP16, size: 9.9mm long, 6.0mm wide, 1.7mm high
    • Working ambient temperature: - 20 ℃ to 85 ℃