Chip Overview

CI230X is a new generation of high-performance neural network intelligent speech chip developed by Chipintelli, which integrates BNPU V3 and CPU core of brain neural network processor developed by Chipintelli, as well as the Combo function of Wi Fi and BLE. The main frequency of the system can reach 220MHz, with built-in large capacity SRAM, integrated PMU power management unit, dual channel high-performance low-power Audio Codec and multi-channel UART, IIC, IIS, PWM, GPIO and other peripheral control interfaces. The chip supports 2.4 GHz 802.11 b/g/n Wi Fi and BLE 5.1 wireless communication protocols. Only a few peripheral devices, such as resistors and capacitors, can realize various hardware solutions for intelligent voice off line products with high cost performance.

CI230X uses industrial design standards and has high environmental reliability. The operating temperature range of the chip is - 40 ° C to+85 ° C. It meets the MSL3 humidity sensitivity level, the 4KV contact discharge test standard of IEC 61000-4-2, the FCC electromagnetic compatibility standard, and the ROHS and REACH environmental protection standards.

CI230X adopts the third-generation BNPU technology of Chipintelli, which supports DNN TDNN RNN CNN and other neural networks and parallel vector operations. It can realize voice recognition, voiceprint recognition, command word self-learning, voice detection and deep learning noise reduction, and has strong echo cancellation and environmental noise suppression capabilities. The chip solution also supports Chinese, English, Japanese and other global languages, and can be widely used in household appliances, lighting, toys, wearables, industry, automobiles and other product fields to achieve voice interaction and control and various intelligent voice solutions.

At present, CI230X is divided into CI2305 and CI2306 chips. These two chip pins are completely compatible, only the built-in Flash capacity is different. The CI2305 is built-in with 4MB Flash, and the CI2306 is built-in with 6MB Flash. Due to its small Flash capacity, CI2305 only supports offline speech recognition and AIOT type applications connected by IOT. CI2306 can support offline speech recognition, and supports more neural network models with larger capacity and more broadcasts, which has better noise reduction effect.

Please click☞CI230X chip Datasheet to download the complete chip Datasheet.

Table G-1 Chip Information

Chip model	FLASH capacity	RAM capacity	Package information
CI2305	4MByte	936KByte	QFN56(7mm*7mm*0.85mm)
CI2306	6MByte	936KByte	QFN56(7mm*7mm*0.85mm)

Some applicable product fields of CI2306:

• Smart home appliances
• Smart toys
• Intelligent lighting
• Intelligent wearable
• Intelligent industry
• Smart car

Figure G-1 Chip Application Block Diagram

The chip features are as follows:

• Wi-Fi

  • Single frequency 2.4GHz IEEE 802.11b/g/n
  • Support STA/AP/STA+AP mode
  • On chip integration protocol stack: TCP/UDP/HTTP/HTTPS/PING/MQTT, TLS support for TCP/UDP/HTTP
  • On chip integrated PA/LNA/TRX switch

• BLE

  • Support Bluetooth LE 5.1
  • Support long range (125Kbps, 500Kbps) and high transmission rate (2Mbps)

• Neural network processor BNPU V30

  • It adopts third-generation hardware BNPU technology, supports DNN TDNN RNN CNN and other neural networks and parallel vector operations, and can realize voice recognition, voiceprint recognition, command word self-learning, voice detection, deep learning noise reduction and other functions

• CPU

  • 32-bit high-performance CPU, supporting up to 220MHz operating frequency
  • 32 bit single cycle multiplier, supporting DSP expansion acceleration

• Memory

  • Built in large capacity SRAM
  • Built in 512bit eFuse
  • Built in 4/6MB Flash

• Audio interface

  • Built in high-performance low-power Audio Codec module, supporting dual ADC sampling and single DAC playback
  • Support Automatic Level Control (ALC) function
  • Support 8kHz/16kHz/24kHz/32kHz/44.1kHz/48kHz sampling rate
  • Support one IIS audio extension channel
  • Support PDM interface, which can interface with single or two digital MEMS microphones

• Power management unit PMU

  • Multiple high-performance LDOs are built in, and only one power supply device is needed for peripheral operation
  • Support 5V power supply direct input, minimum power supply range support 3.6V input, maximum support 5.5V input

• Encryption and decryption

  • Built in AES-128/AES-192/AES-256 hardware encryption and decryption engine
  • Built in true random number generator

• SAR ADC

  • Two 12bit SAR ADC input channels, sampling frequency up to 1MHz

• Peripherals and timers

  • Two UART interfaces can support up to 3M baud rate
  • One IIC interface, which can be extended by external IIC devices
  • 6-way PWM interface, convenient direct drive for lamp control and motor applications
  • Built in 4 groups of 32 bit timers
  • Built in 1 set of independent watchdog (IWDG)
  • Built in 1 set of window watchdog (WWDG)

• GPIO

  • It supports 33 high-speed GPIO ports and can be used as the master IC
  • Except the GPIO port corresponding to the PD, other GPIO ports can be configured with interrupt function
  • Some GPIOs support direct communication of wide voltage 5V level signals without external level conversion

• Software development support

  • It provides complete software development package, application scheme examples and online firmware production of voice development platform. For details, please visit:https://aiplatform.chipintelli.com

• Firmware burning and protection

  • Support UART upgrade and firmware protection

• EMC and ESD

  • Good EMC design, supporting FCC standards
  • Internal ESD enhanced design can pass 4KV contact discharge test

• ROHS and REACH

  • Adopt environment-friendly materials and support ROHS and REACH tests

• Packaging and operating temperature range

  • Packaging form: QFN56, the size is 7mm long, 7mm wide and 0.85mm high
  • Ambient operating temperature: - 40 ℃ to 85 ℃