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Chip Overview

The CI230X series represents Chipintelli’s latest generation of high-performance neural network voice chips, integrating the company’s self-developed Brain Neural Processing Unit (BNPU) V3, CPU cores, and combined Wi-Fi/BLE functionality. With a system frequency of up to 220MHz and large-capacity built-in SRAM, these chips feature an integrated PMU power management unit, dual-channel high-performance low-power Audio Codec, and multiple peripheral interfaces including UART, IIC, IIS, PWM, and GPIO. Supporting 2.4 GHz 802.11 b/g/n Wi-Fi and BLE 5.1 wireless communication protocols, these chips require minimal external components (just a few resistors and capacitors) to implement various intelligent voice product solutions with excellent cost-performance ratio.

Designed to industrial standards, the CI230X series ensures high environmental reliability with an operating temperature range of -40°C to +85°C. The chips comply with MSL3 moisture sensitivity level, meet IEC 61000-4-2 4KV contact discharge test standards, and adhere to FCC EMC standards, as well as ROHS and REACH environmental protection standards.

Leveraging Chipintelli’s V3 BNPU technology, the CI230X series supports neural networks including DNN, TDNN, RNN, and CNN, along with parallel vector operations. They enable advanced features such as speech recognition, voiceprint recognition, command word self-learning, voice activity detection, and deep learning noise reduction, delivering robust echo cancellation and environmental noise suppression capabilities. Supporting multiple global languages including Chinese, English, and Japanese, these chips are ideal for a wide range of applications such as home appliances, lighting, toys, wearable devices, industrial equipment, and automotive products, enabling voice interaction, control, and various intelligent voice solutions.

The CI230X series currently includes two models: CI2305 and CI2306. These chips are pin-to-pin compatible, differing only in their built-in Flash capacity - the CI2305 has 4MB Flash while the CI2306 has 6MB Flash. Due to its smaller Flash capacity, the CI2305 only supports offline speech recognition combined with IoT connectivity for AIoT applications. In contrast, the CI2306 supports both offline and online speech recognition, accommodates larger neural network models and more audio prompts, and delivers superior noise reduction performance.

Documentation

For complete technical specifications, please download the CI230X Datasheet.

Table G-1 Chip Information

Chip model FLASH capacity RAM capacity Package information
CI2305 4MByte 936KByte QFN56(7mm*7mm*0.85mm)
CI2306 6MByte 936KByte QFN56(7mm*7mm*0.85mm)

Note: Both models maintain full pin compatibility, allowing for flexible hardware design and upgrades.

Key Application Fields

CI2306 is particularly well-suited for:

  • Smart home appliances
  • Interactive toys and educational devices
  • Smart lighting solutions
  • Wearable technology
  • Industrial automation
  • Automotive voice interfaces

CI2306应用框图

Figure G-1 Chip Application Block Diagram

Chip Key Features

Wi-Fi - 2.4GHz IEEE 802.11b/g/n compliant - Operating Modes: - Station (STA) - Access Point (AP) - Concurrent STA+AP - Integrated Protocol Stack: - TCP/UDP/HTTP/HTTPS - MQTT - TLS encryption support - On-chip Components: - Power Amplifier (PA) - Low-Noise Amplifier (LNA) - TRX switch

Bluetooth Low Energy - Bluetooth 5.1 compliant - Transmission Modes: - Long Range (125Kbps, 500Kbps) - High Speed (2Mbps)

  • Neural network processor BNPU V3

    • It adopts BNPU V3 technology, supports DNN TDNN RNN CNN and other neural networks and parallel vector operations, and can realize voice recognition, voiceprint recognition, command word self-learning, voice detection, deep learning noise reduction and other functions

  • CPU

    • 32-bit high-performance CPU, supporting up to 220MHz operating frequency
    • 32 bit single cycle multiplier, supporting DSP extension acceleration

  • Memory

    • Built in large capacity SRAM
    • Built in 512bit eFuse
    • Built in 4/6MB Flash

  • Audio interface

    • Built in high-performance low-power Audio Codec module, supporting dual ADC sampling and single DAC playback
    • Support Automatic Level Control (ALC) function
    • Support 8kHz/16kHz/24kHz/32kHz/44.1kHz/48kHz sampling rate
    • Support one IIS audio extension channel
    • Support PDM interface, which can interface with single or two digital MEMS microphones

  • Power management unit PMU

    • Multiple high-performance LDOs are built in, and only one power supply device is needed for peripheral operation
    • Support 5V power supply direct input, minimum power supply range support 3.6V input, maximum support 5.5V input

  • Encryption and decryption

    • Built in AES-128/AES-192/AES-256 hardware encryption and decryption engine
    • Built in true random number generator

  • SAR ADC

    • Two 12bit SAR ADC input channels, sampling frequency up to 1MHz

  • Peripherals and timers

    • Two UART interfaces can support up to 3M baud rate
    • One IIC interface, which can be extended by external IIC devices
    • 6-way PWM interface, convenient direct drive for lamp control and motor applications
    • Built in 4 groups of 32 bit timers
    • Built in 1 set of independent watchdog (IWDG)
    • Built in 1 set of window watchdog (WWDG)

  • GPIO

    • It supports 33 high-speed GPIO ports and can be used as the master IC
    • Except the GPIO port corresponding to the PD, other GPIO ports can be configured with interrupt function
    • Some GPIOs support direct communication of wide voltage 5V level signals without external level conversion

  • Software development support

    • It provides complete software development package, application solution examples and online firmware production of voice development platform. For details, please visit:https://aiplatform.Chipintelli.com

  • Firmware flashing and protection

    • Support UART upgrade and firmware protection

  • EMC and ESD

    • Good EMC design, supporting FCC standards
    • Internal ESD enhanced design can pass 4KV contact discharge test

  • ROHS and REACH

    • Adopt environment-friendly materials and support ROHS and REACH tests

  • Packaging and operating temperature range

    • Packaging form: QFN56, the size is 7mm long, 7mm wide and 0.85mm high
    • Ambient operating temperature: - 40 ℃ to 85 ℃