Electrical Parameters¶
The electrical characteristics of CI231 series chips are shown in the following table.
Table E-1 Electrical Parameters
| Symbol | Parameter | Minimum | Typical | Maximum | Unit |
|---|---|---|---|---|---|
| VIN5V | PMU input pin voltage generally 5V | 3.6 | 5 | 5.5 | V |
| AVDD | Analog and Codec supply voltages | 2.97 | 3.3 | 3.63 | V |
| VDD33 | Chip IO supply voltage | 2.97 | 3.3 | 3.63 | V |
| VDD11 | Chip core power supply voltage | 0.99 | 1.1 | 1.22 | V |
| VDDRF | Bluetooth supply voltage | 1.9 | 3.3 | 3.6 | V |
| VIH | Output high voltage，3.0V ≤ VDD33 ≤ 3.6V | 0.7*VDD33 | - | - | V |
| VIL | Output low voltage，3.0V ≤ VDD33 ≤ 3.6V | - | - | 0.3*VDD33 | V |
| VOL | Output low voltage @IOL = 12mA | - | - | 0.4 | V |
| VOH | Output high voltage @IOH = 20mA | 2.4 | - | - | V |
| I5VIO | IO (5V withstand voltage) Output 3.3V drive current | 5 | - | 23 | mA |
| I33VIO | IO (3.3V withstand voltage) Output 3.3V drive current | 12 | - | 26 | mA |
| ΣIVDD | Sum of all IO currents of the chip | - | - | 180 | mA |
| Ta1 | Ambient temperature of the chip | -40 | - | +85 | ℃ |
| Tst | The chip stores ambient temperature | -55 | - | +150 | ℃ |
Table E-2 Bluetooth parameter table
| No | Parameter | Symbol | Conditions | MIN | TYP | MAX | UNIT |
|---|---|---|---|---|---|---|---|
| 1 | Current in power down | Ipd | Register retention | - | 2 | - | uA |
| 2 | Current in standby | Istb | Crystal on | - | 40 | - | uA |
| 3 | Current in TX 0dBm | Itx | PA under 0dBm | - | 15 | - | mA |
| 4 | Current in RX 2Mbps | Irx | RX mode | - | 17 | - | mA |
| 5 | Operation frequency | Freq | - | 2400 | - | 2525 | MHz |
| 6 | PLL frequency step | Delta F | - | - | - | 1 | MHz |
| 7 | Freq deviation@1Mbps | Df | - | - | - | 250 | KHz |
| 8 | Freq deviation@2Mbps | Df | - | - | - | 320 | KHz |
The previous power consumption is measured when VDDRF is equal to 3.3V¶
Please control the furnace temperature and time when the chip is SMT welding. The temperature curve of an SMT welding is shown in the figure below.
Figure E-1 SMT welding temperature curve of the chip
The moisture sensitivity level of the chip is MSL3, and please store it in accordance with MSL3 conditions before use. If the storage time after unpacking exceeds the requirements of MSL3, please bake before SMT welding.