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Electrical Parameters

The electrical characteristics of CI231 series chips are shown in the following table.

Table E-1 Electrical Parameters

Symbol Parameter Minimum Typical Maximum Unit
VIN5V PMU input pin voltage generally 5V 3.6 5 5.5 V
AVDD Analog and Codec supply voltages 2.97 3.3 3.63 V
VDD33 Chip IO supply voltage 2.97 3.3 3.63 V
VDD11 Chip core power supply voltage 0.99 1.1 1.22 V
VDDRF Bluetooth supply voltage 1.9 3.3 3.6 V
VIH Output high voltage,3.0V ≤ VDD33 ≤ 3.6V 0.7*VDD33 - - V
VIL Output low voltage,3.0V ≤ VDD33 ≤ 3.6V - - 0.3*VDD33 V
VOL Output low voltage @IOL = 12mA - - 0.4 V
VOH Output high voltage @IOH = 20mA 2.4 - - V
I5VIO IO (5V withstand voltage) Output 3.3V drive current 5 - 23 mA
I33VIO IO (3.3V withstand voltage) Output 3.3V drive current 12 - 26 mA
ΣIVDD Sum of all IO currents of the chip - - 180 mA
Ta1 Ambient temperature of the chip -40 - +85
Tst The chip stores ambient temperature -55 - +150

Table E-2 Bluetooth parameter table

No Parameter Symbol Conditions MIN TYP MAX UNIT
1 Current in power down Ipd Register retention - 2 - uA
2 Current in standby Istb Crystal on - 40 - uA
3 Current in TX 0dBm Itx PA under 0dBm - 15 - mA
4 Current in RX 2Mbps Irx RX mode - 17 - mA
5 Operation frequency Freq - 2400 - 2525 MHz
6 PLL frequency step Delta F - - - 1 MHz
7 Freq deviation@1Mbps Df - - - 250 KHz
8 Freq deviation@2Mbps Df - - - 320 KHz

The previous power consumption is measured when VDDRF is equal to 3.3V

Please control the furnace temperature and time when the chip is SMT welding. The temperature curve of an SMT welding is shown in the figure below.

SMT焊接温度曲线

Figure E-1 SMT welding temperature curve of the chip

The moisture sensitivity level of the chip is MSL3, and please store it in accordance with MSL3 conditions before use. If the storage time after unpacking exceeds the requirements of MSL3, please bake before SMT welding.