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CI-F322GS01S Module Datasheet

Module Introduction

Overview

The CI-F322GS01S is a universal, portable, low-power, high-performance AI ENC noise reduction module, with CI13322 as its main chip. It is widely applicable in voice noise reduction scenarios such as walkie-talkies, microphones, and headsets.

Supported noise suppression types include: wind noise, howling, keyboard sounds, traffic noise, music, and crowd noise.

Module Block Diagram

Figure 1 Module Application Block Diagram

The CI-F322GS01S module features:

  • Compact design: Module dimensions of 16mm × 11mm with castellated holes for easy reflow soldering
  • Minimal components: Only requires power supply, microphone, and a few external passive components for full functionality
  • Simple interfaces: One 3.3V power supply, three UART communication interfaces, one microphone interface, one noise-reduced audio output, and one I2S interface
  • Low power consumption: Suitable for energy-efficient or battery-powered products
  • High reliability: All BOM components are industrial-grade

Main Chip Introduction

CI13322 is a new generation high-performance neural network intelligent voice chip developed by Chipintelli, integrating Chipintelli’s self-developed BNPU V3.5 and CPU core. With a system frequency up to 210MHz and built-in 288KB SRAM, it features an integrated PMU power management unit, RC oscillator, single-channel high-performance low-power Audio Codec, and multiple peripheral control interfaces including UART, I2C, PWM, and GPIO. The CI13322 chip requires minimal external components, making it highly cost-effective for various intelligent voice product hardware solutions.

Designed to industrial standards, the CI13322 offers excellent environmental reliability with an operating temperature range of -40°C to +85°C, MSL3 moisture sensitivity level, 4KV contact discharge test standard compliance (IEC 61000-4-2), and meets RoHS and REACH environmental standards.

Utilizing Chipintelli’s next-generation BNPU technology, the CI13322 supports neural networks including DNN, TDNN, RNN, and CNN, along with parallel vector operations, enabling high-performance voice recognition, noise reduction, and robust environmental noise suppression. The CI13322 solution also supports multiple global languages including Chinese, English, and Japanese, making it suitable for a wide range of applications including home appliances, lighting, toys, wearables, industrial, and automotive products.

For more detailed information about the CI13322 chip, please visit:

☞CI13322 Chip Datasheet

Module Specifications

Physical View

Module Physical View and Chip Location

Figure 2 Module Physical View and Chip Location

As shown in Figure 2, the CI-F322GS01S module features single-sided SMT assembly with the CI13322 voice processor as the main component. The working flow involves audio input from the microphone, noise reduction processing by the CI13322 IC, and output of the processed audio through the HPOUT pin.

Note: The physical view is for reference only. The silkscreen on components may vary between production batches, but this does not affect module performance. The actual module appearance may vary.

Module Dimensions

Module Dimensions - Top View

Module Dimensions - Side View

Figure 3 Module Dimensions

Refer to Figure 3 for the dimensional data of the CI-F322GS01S module when designing mechanical enclosures or planning PCB layouts.

Hardware Interface Definition

Module Pinout

Figure 4 Module Pinout

The CI-F322GS01S module includes the following functional interfaces:

  1. Single microphone interface: Audio input. Supports common microphone sensitivities: -32dB, -38dB, -42dB, -58dB.
  2. Noise-reduced audio output: HPOUT provides processed audio output, typically connected to the product’s audio input interface.
  3. UART interface: UART0 is used for firmware updates.
  4. Other interfaces: Refer to the pin function definition table below.

Pin functions are defined in Table 1:

Table 1 Pin Definition Table

Pin Name I/O Type Drive Capability Default State Function
1 VDD33 P - - 3.3V Power Supply
2 GND P - - Ground
3 HPOUT O - - DAC Output
4 AGND P - - Analog Ground
5 MICL+ - - - Microphone Positive
6 MICL- - - - Microphone Negative
7 PB6 IO 4mA IN, T+U ● GPIO PB6 (default)
● UART0_RX
● I2C_SCL
● PWM2
● PWMN
8 PB5 IO 4mA IN, T+U ● GPIO PB5 (default)
● UART0_TX
● I2C_SDA
● PWM1
● PWMP
9 PB0 IO 4mA IN, T+D ● GPIO PB0 (default)
● PWM1
● RX1
● INT1
10 PA7 IO 4mA IN, T+D ● GPIO PA7 (default)
● PWM0
● TX1
● INT0
11 PA6 IO 4mA IN, T+D ● GPIO PA6 (default)
● I2S_MCLK
● -
● UART2_RX
● PWM0
12 PA5 IO 4mA IN, T+D ● GPIO PA5 (default)
● I2S_SCLK
● -
● UART2_TX
● PWM3
● PWMN0
13 PA4 IO 4mA IN, T+U ● GPIO PA4 (default)/PG_EN (determines programming mode based on power-on level, high level enables programming)
● I2S_SDO
● -
● -
● PWM2
● PWMP
14 PA3 IO 4mA IN, T+D ● GPIO PA3 (default)
● I2S_LRCLK
● I2C_SCL
● UART1_RX1
● PWM1
● PWMN
15 PA2 IO 4mA IN, T+D ● GPIO PA2 (default)
● I2S_SDI
● I2C_SDA
● UART1_TX
● PWM0
● PWMP

Symbol definitions in the table:

I = Input

O = Output

IO = Bidirectional

P = Power or Ground

T+D = Tristate with pull-down

T+U = Tristate with pull-up

OUT = Power-on default is output mode

IN = Power-on default is input mode

Electrical Characteristics

Table 2 Electrical Characteristics

Parameter Condition Min Typ Max Unit Note
Module Supply Voltage / 3.15 3.3 3.45 V
Module Operating Current / / 26 / mA
Chip I/O Voltage / 3.15 3.3 3.45 V
Module UART Interface Voltage / 3.15 3.3 3.45 V

Noise Reduction Specifications

Table 3 Noise Reduction Specifications

Parameter Description Min Typ Max Unit Note
Signal-to-Noise Ratio Ratio of voice to background noise ≥-5 ≥0 / dB /
Noise Suppression Maximum introduced noise / / ≤80 dB /
Power-on Time Time from power-on to noise-reduced audio output / <200 / ms /
Processing Latency Time from audio input to noise-reduced audio output / 78 / ms /
Pickup Distance Distance from speaker to microphone / ≤10 / cm Contact our sales or FAE for other parameters
Microphone Recommended omnidirectional microphone sensitivity -58 / -32 dB Contact our sales or FAE for other parameters
Input Amplitude Maximum input amplitude when directly connecting audio signal / 0.5 0.7 V Contact our sales or FAE for other parameters

SNR Improvement Capability

Signal-to-Noise Ratio (SNR) improvement in different environments, with an average improvement of about 40dB.

Table 4 SNR Improvement Data

Test Environment Original Audio SNR (dB) Processed Audio SNR (dB)
White Noise 10.85 43.95
Marketplace 4.30 47.34
Supermarket 5.39 47.04
Wind Noise 4.13 49.88
Construction Site 7.46 39.25
Traffic Intersection 7.37 52.11
Hair Salon 5.77 49.39
Bubble Tea Shop 6.39 49.46
Shopping Mall 3.55 42.08
Arcade 6.30 48.65
Average 6.15 46.92

Environmental Specifications

Table 5 Temperature and Humidity Specifications

Parameter Min Typ Max Unit Note
Operating Temperature -25 25 85 °C /
Storage Temperature -40 25 100 °C /
Storage Humidity 0% / 5% RH /

Module Application

Power-up and Startup

When using the module, connect the 3.3V power supply and microphone, then connect HPOUT to the product’s audio input interface (e.g., walkie-talkie microphone input). The module will start upon power-up. Speak into the microphone, and the processed audio will be output from HPOUT. The UART0 interface will display debug information during this process. Note that the module’s UART interface operates at 3.3V logic level; level shifting is required when interfacing with 5V systems.

The 3.3V power supply must provide a stable 100mA current with ripple below 50mV.

Module Application Circuit Reference

Figure 5 Module Application Circuit Reference

Module Application Connection

The module can be integrated into existing products as shown below:

Module Application Connection Diagram

Figure 6 Module Application Connection Diagram

Demo Board Operation

A noise reduction module demo board (Model: CI-F32XGS01S_MB) is available for purchase on our platform.

Demo Board Operation

Figure 7 Demo Board Operation

Software Development

The default firmware included with the module is for initial evaluation. For custom development, please contact our FAE team.

Firmware Programming

Pre-programming Preparation

Before programming the module, prepare the following items:

  • Module to be programmed
  • USB-to-UART adapter
  • Firmware programming tool (pack_update_tool.exe)
  • Firmware file (*.bin)
  • Microphone
  • Jumper wires

Items Required for Firmware Programming

Figure 8 Items Required for Firmware Programming

Hardware Connection and Programming

Using the USB-to-UART adapter as an example, connect the power, ground, and UART pins to the corresponding module pins (note that the adapter’s RXD and TXD should connect to the module’s UART0_TX and UART0_RX respectively).

Open the firmware programming tool (PACK_UPDATE_TOOL.exe, available in the SDK development package under CI13LC_SDK\tools), select the correct chip model, click the firmware update button, select the prepared firmware file, and choose the correct COM port assigned to the USB-to-UART adapter. After preparation, power cycle the module to enter programming mode and download the firmware. If the USB-to-UART adapter is not recognized, install the appropriate drivers on your computer.

Firmware Programming Tool

Figure 9 Firmware Programming Tool

Post-programming Functional Test

After successful programming, test the module’s functionality to verify the firmware. Connect a microphone to the module and connect HPOUT to the product’s audio input. Power on and speak into the microphone; the processed audio should be output from HPOUT. If functioning correctly, the programming was successful. If not, troubleshoot accordingly.

Troubleshooting

This section lists common issues and solutions when using the module.

  • Module cannot be programmed or firmware updated.

Check the following:

  1. Ensure TX, RX, and GND are connected before powering on with 3.3V.
  2. Verify UART pin connections (TX/RX not swapped), USB-to-UART driver installation, and correct COM port selection.
  3. Check if pin 13 (PA4) is floating. It must be floating during programming.
  4. If issues persist, measure the module’s power supply voltages (3.3V, 1.1V) using a multimeter. Refer to the hardware measurement points below. If voltage or crystal issues are found, replace the module or repair the hardware. If problems continue, contact technical support.

Hardware Measurement Points

Figure 10 Hardware Measurement Points
  • No noise-reduced audio output after programming and power-up.

Check the following:

  1. Confirm the programmed firmware is compatible with the board.
  2. Verify HPOUT is properly connected to the product.

Use an oscilloscope to measure the noise-reduced audio output. Speak into the microphone after power-up; the processed audio should be present at HPOUT. If no output is detected, verify the firmware. If output is present but not functioning as expected, check other points in the signal chain. If issues persist, contact technical support.

Noise-reduced Audio Output Measurement Points

Figure 11 Noise-reduced Audio Output Measurement Points

Additional Application Notes

Due to the chip’s high ESD rating and the module’s design for user expansion, ESD protection devices are not included on the module. For products requiring high ESD protection, add ESD devices to the main board to ensure product reliability. When handling or soldering, wear an anti-static wrist strap or gloves.

Ensure correct connections for the microphone, power supply, and UART interfaces.

Note that the module’s UART interface operates at 3.3V logic level. Use a 3.3V-compatible UART for communication. For software debugging, use a USB-to-UART adapter with the SDK. Add UART print commands in the software, compile the firmware, program it, and verify functionality.

Production Guide, Storage, and Ordering Information

Production and Storage Guidelines

  1. The CI-F322GS01S module must be assembled using SMT equipment. After opening the packaging, complete SMT assembly within 24 hours or reseal in a moisture barrier bag.

  2. Storage conditions for CI-F322GS01S module:

  • Modules in vacuum-sealed moisture barrier bags can be stored at -40°C to +100°C and 0% to 85% relative humidity.

  • The moisture barrier bag contains a humidity indicator card as shown below:

Humidity Indicator Card

Figure 12 Humidity Indicator Card
  1. If the humidity indicator card shows the following color changes, bake the modules according to the specified parameters:

  • If the 30%, 40%, and 50% rings are all blue when opening the vacuum bag, bake for 2 hours.

  • If the 30% ring turns pink, bake for 4 hours.

  • If both 30% and 40% rings turn pink, bake for 6 hours.

  • If 30%, 40%, and 50% rings all turn pink, bake for 12 hours.

  1. Baking parameters:

  • Baking temperature: 125±5°C

  • Alarm temperature: 130°C

  • Baking cycles: 1

  • Cool naturally until module temperature is below 36°C before SMT assembly

  • If more than 12 hours elapse after baking without assembly, re-bake the modules.

  1. Implement ESD protection throughout the assembly process. Operators should wear anti-static gloves/wrist straps.

  2. For optimal production yield, perform visual inspection and AOI testing on all assembled modules, paying attention to temperature profile, pick-and-place method, and component orientation.

Module Reflow Profile

Figure 13 Module Reflow Profile

Packaging and Ordering Information

Table 6 Bulk Ordering and Packaging Information

Model Packaging Modules per Tray Modules per Pack Modules per Carton
CI-F322GS01S Tray + ESD Bag + Carton 140pcs 15 trays (2,100pcs) 3 packs (6,300pcs)

Purchasing and Technical Support

To purchase samples, visit ☞Sample Purchase or click ☞Samples and Bulk Purchasing for more information.

For technical support, visit the ☞Chipintelli AI Platform.