CI-G16XGS02J Module Datasheet¶
Module Introduction¶
Overview¶
The CI-G16XGS02J is a general-purpose, portable, low-power, high-performance voice recognition module with BLE functionality, developed for low-cost offline voice applications. Model: CI-G16XGS02J, with main chips CI23161 and CI23162, supports up to 300 offline voice commands (the exact number varies by model).
The module features:
Compact size of 30mm×40mm, operating voltage of 3.6V-5.5V, with one microphone channel, one speaker channel, one 5V power supply, and UART interface (5V level). The module can be powered directly by connecting a microphone and speaker, or connected to a main control board via the UART interface for power supply (5V) and communication (UART or GPIO control) without soldering. The module includes two 3.5mm screw holes for easy mounting and installation.
- The main chip supports BLE, offline neural network computing, single-microphone noise reduction enhancement, and 360° omnidirectional sound pickup, effectively suppressing environmental noise to ensure accurate voice recognition in noisy environments. The offline voice recognition does not rely on network connectivity, with low latency, high performance, over 97% recognition rate, up to 10-meter recognition distance, and response time as fast as 0.2 seconds.
- The module is suitable for products with energy efficiency requirements and battery-powered devices.
- Supports BLE protocol, allowing control via WeChat Mini Program.
- Uses industrial-grade components for high reliability.
| Module Type | Local Commands Up to 100 | Local Commands Up to 300 |
|---|---|---|
| Single-Mic Offline Voice BLE Module with Connector | CI-G161GS02J | CI-G162GS02J |
Main Chip Introduction¶
The CI23161 and CI23162 are AI chips specifically designed for voice processing, supporting local voice recognition and multiple global languages including Chinese, English, and Japanese. They are widely applicable in various fields such as home appliances, lighting, toys, wearable devices, industrial equipment, and automotive products, enabling voice interaction, control, and various intelligent voice solutions.
The CI23161 and CI23162 integrate Chipintelli’s self-developed Brain Neural Processing Unit (BNPU) V3.5 and CPU core, with a system frequency up to 210MHz. They feature 288KB of built-in SRAM, integrated PMU power management unit, RC oscillator, single-channel high-performance low-power Audio Codec, and multiple peripheral control interfaces including UART, I2C, PWM, and GPIO. The chips also integrate high-performance, low-power Bluetooth BLE. With minimal external components (resistors and capacitors), these chips can realize various intelligent voice product hardware solutions with excellent cost performance.
For more detailed information about the CI23161 and CI23162 chips, please visit the following links:
Module Application Scenarios¶
This module can be used as a voice recognition front-end combined with a customer’s main control board, or as a single-chip main control module for applications such as lighting and toys. When in use, it requires an external microphone, speaker, and 5V power supply.
The CI-G16XGS02J series modules support 100-300 offline voice recognition commands depending on the chip model, and can be applied to various end products such as smart electric fans, heating tables, clothes dryers, small household appliances, toys, and lighting.
Module Specifications¶
Physical Layout¶
As shown in Figure 4, the voice recognition module features single-sided surface mounting, with main ICs including the voice recognition chip and audio amplifier. Voice commands are input through the microphone, processed by the voice recognition IC for recognition and command processing, and the feedback audio is then sent to the audio amplifier to drive the speaker. The audio amplifier has a maximum output power of 1.5W@8Ω and 2W@4Ω.
Module Dimensions¶
As shown in Figure 5, the module is rectangular in shape with dimensions of 30±0.3mm × 40±0.15mm, PCB thickness of 1.6±0.2mm, and module height of 7.6±0.4mm. Users can design the structure based on these dimensions.
Module Hardware Interface Definition¶
The module has the following functional interfaces:
- Two-wire single microphone interface with 2.0mm pitch female connector. For optimal voice recognition performance, it is recommended to use a microphone with a sensitivity of -32±3dB and signal-to-noise ratio ≥65dB. Click ☞Reference Microphone Devices for more information.
- Two-wire single speaker interface with 2.5mm pitch female connector. For optimal audio playback quality, it is recommended to use a speaker with an acoustic chamber. Click ☞Reference Speaker Devices for more information.
- Four-wire power supply and UART interface with 2.5mm pitch female connector. Please refer to Figure 6 for the pin sequence. The UART pins in this interface can also be configured as GPIO ports in addition to their serial communication function.
The functional description of all external pins is shown in Table 2:
| Pin No. | Pin Name | I/O Type | IO Drive Capability | Power-on Default State | Function Definition |
|---|---|---|---|---|---|
| 1 | 5V | P | - | - | 5V Power |
| 2 | GND | P | - | - | Ground |
| 3 | UART_TX | IO, T+U | 4mA | IN, T+U | 1.UART0_TX 2.PB5 |
| 4 | UART_RX | IO, T+U | 4mA | IN, T+U | 1.UART0_RX 2.PB6 |
| 5 | MICL- | - | - | - | Microphone Negative |
| 6 | MICL+ | - | - | - | Microphone Positive |
| 7 | SKPL- | - | - | - | Speaker Output |
| 8 | SKPL+ | - | - | - | Speaker Output |
Symbol definitions in the table above:
I - Input
O - Output
IO - Bidirectional
P - Power or ground
T+D - Tristate plus pull-down
T+U - Tristate plus pull-up
OUT - Power-on defaults to output mode
IN - Power-on defaults to input mode
Module Electrical Characteristics¶
| Parameter | Condition | Min | Typ | Max | Unit | Note |
|---|---|---|---|---|---|---|
| Module Supply Voltage | - | 3.6 | 5 | 5.5 | V | NOTE1 |
| Module Current in Playback (Normal Volume) | 4Ω 3W Speaker | - | 100 | - | mA | NOTE2 |
| Module Operating Current | - | - | 55 | - | mA | NOTE3 |
| Chip I/O Interface Voltage | - | 3 | 3.3 | 3.6 | V | - |
| Module UART Interface Voltage | - | 4.5 | 5 | 5.5 | V | - |
NOTE1: 5V is the typical supply voltage for the module. Input voltage exceeding 5.5V may damage the module.
NOTE2: The maximum current in playback mode can reach 250mA. As a rule of thumb, a power supply with 500mA driving capability is recommended for the module (2x margin).
NOTE3: Typical value is measured in mute state. Maximum value is measured during recognition and playback.
Bluetooth Electrical Characteristics¶
| Parameter | Condition | Min | Typ | Max | Unit | Note |
|---|---|---|---|---|---|---|
| Frequency range | - | 2.3 | - | 2.6 | GHz | - |
| Current in TX 0dBm | - | - | 2.5 | - | mA | - |
| Current in RX 1Mbps | - | - | 2.8 | - | mA | - |
| Current in power down | - | - | 2 | - | μA | - |
| Max Output Power | 50Ω | - | +5 | - | dBm | - |
Module Temperature and Humidity Parameters¶
The temperature and humidity parameters for CI-G16XGS02J are consistent, as shown in Table 4.
| Parameter | Min | Typ | Max | Unit | Note |
|---|---|---|---|---|---|
| Operating Temperature | -40 | 25 | 85 | °C | - |
| Storage Temperature | -40 | 25 | 100 | °C | - |
| Storage Humidity | 0% | - | 5% | RH | - |
Module Application¶
Power-up and Startup¶
When using this module, connect the speaker and microphone, then supply 5V power to the module through the power connector. Upon power-up, the module will start automatically, and the speaker will play a prompt tone. The UART port will output print information, which can be viewed by connecting to a computer using a USB-to-TTL Tool and terminal software. The module is considered successfully started when the print information is visible, as shown in Figure 7. Note that the module’s UART interface operates at 5V level high-speed serial communication, eliminating the need for level conversion when connecting to other 5V systems.
The voice recognition chip and audio amplifier on the module are powered by a 5V supply. The 5V power supply must provide a rated current of 500mA, with stable voltage and ripple within 300mV.
Default Voice Commands¶
For mass production modules, they are typically pre-loaded with customer-specified command firmware before leaving the factory. If no specific firmware is specified, the module comes with default firmware containing preset voice commands for testing purposes. Some of these default commands are shown in Figure 8 below:
Default UART Communication Protocol¶
The module’s default firmware supports a UART communication protocol for MCU communication. This protocol is extensible and has the following features:
- Complete transmission packet including: header/tail, length, checksum, message type, and sequence number
- Supports variable-length commands for easy expansion
- Message types (command, notification, response)
- Command messages are configurable with ACK responses. Notification messages don’t require ACK
- Message format is compatible with bootloader upgrade, distinguished by header from bootloader protocol
- Default baud rate: 9600 bps
- Note: The module only reserves the UART0 interface, which is by default used for print output. To use UART0 for the above protocol, code modification is required. Refer to the UART protocol section in ☞CI13LC Series Chip SDK for implementation details.
- Supported commands: Query protocol version, query system version, set volume (volume levels defined in user_config.h), play local prompts, reset command, etc. The protocol format is shown below:
Example 1:
A5 FC 07 00 A0 91 18 01 55 E0 01 00 00 1B 9B 02 FB is parsed as follows:
A5 FC: Header
07 00: 7 bytes of valid data
A0: Indicates voice command information
91: Command number 0x91 (this data contains voice command information)
18: Packet sequence number, incremented with each transmission (0x08 in this case)
01 55 E0 01 00 00: Unique data for the current command
1B: Command threshold
9B 02: Checksum
FB: End marker
Note: If only the command and threshold are of interest, focus on the 7 bytes of valid data in blue.
Example 2:
A5 FC 02 00 A3 9A 17 00 B1 05 02 FB is parsed as:
A5 FC: Header
02 00: 2 bytes of valid data
A3: Indicates notification data
9A: Command number 0x9A (module state change notification)
17: Packet sequence number (0x07 in this case)
00 B1: Valid data (indicates wake-up state)
05 02: Checksum
FB: End marker
Note: This is notification data that users can utilize as needed.
For more detailed protocol parsing, refer to the UART protocol section in ☞CI13LC Series Chip SDK. Below is a reference screenshot of protocol data:
Software Development¶
The default firmware included with the module is primarily for initial user experience. For software development, users need to register and log in to the Chipintelli AI Speech Development Platform (https://aiplatform.Chipintelli.com) for rapid voice firmware development. The “Development Resources” section of the platform provides access to the SDK and related hardware documentation.
For first-time users of the Chipintelli AI Speech Development Platform, it’s recommended to start with the Beginner’s Guide to understand the development process. You can also refer to the documentation center’s Video Tutorials for more information about solutions and SDK development.
- SDK development package download
- Model development (language model + acoustic model)
- Voice synthesis
- Command word information table and audio file association
- Firmware packaging
For detailed development procedures, please refer to ☞CI13LC Series Chip SDK.
Firmware Programming¶
Preparation Before Programming¶
Before programming the module, prepare the following items:
- Module to be programmed
- USB-to-UART adapter
- Firmware programming tool (pack_update_tool.exe)
- Firmware file (*.bin format)
- 2.0mm pitch microphone
- 2.5mm pitch speaker
- DuPont wires
Hardware Connection and Programming¶
- Voice Firmware Programming: Using the USB-to-UART adapter shown above as an example, connect the power, ground, and UART communication pins to the corresponding pins on the module before programming. Also, short the PGEN pin on the board. Note that the RXD and TXD of the USB-to-UART adapter correspond to UART0_TX and UART0_RX of the module, respectively. The connection method is shown in the figure below.
Open the firmware programming tool (PACK_UPDATE_TOOL.exe, which can be found in the CI231X_SDK\tools directory of the SDK development package). Select the corresponding chip model, click the Firmware Update button, choose the prepared firmware file, and confirm the COM port number assigned to the USB-to-UART adapter by the computer. After preparation is complete, power on the module to enter Firmware Update mode and start downloading the firmware. If the computer cannot recognize the USB-to-UART adapter, please install the corresponding driver first.
Functional Testing After Programming¶
-
Voice Function Test: After firmware programming, it is recommended to perform functional testing on the module to verify the success of the firmware programming. Before testing, connect the microphone and speaker to the module, power it on to confirm if the power-on prompt sound is played, and test if the wake word and command words can wake up and be recognized normally. If all functions work properly, the module functions normally and the programming is successful; otherwise, the programming has failed, and further investigation is needed.
-
Bluetooth Function Test:
-
Search for the “Chipintelli IoT” or “AI Voice Control” mini-program in WeChat
-
Enable Bluetooth permissions (some phones may require location permissions)
-
Turn on the phone’s Bluetooth
-
Add a device by clicking the “+” button or the “Add Device” button
-
Enter the device scanning interface and click on the detected device** (Currently supported devices in this mini-program include: tea makers, air conditioners, lights, fans…)
-
Confirm device connection
-
Name the device
-
Return to the home page after successful connection
-
Click on the added device to enter the device operation interface
Troubleshooting¶
This section lists some common issues that may occur during module use and their corresponding solutions.
Module cannot be programmed or firmware cannot be updated:
If this issue occurs, please check the following:
- Ensure TX, RX, and GND are properly connected, then select the correct COM port in the programming tool (Figure 13) before applying 5V power.
- Verify the UART pins are correctly connected (TX to RX and vice versa), the USB-to-UART driver is properly installed, and the correct COM port is selected in the programming tool.
- If the above checks are correct but the module still cannot be programmed, use a multimeter to measure the power supply voltages (5V, 3.3V, 1.1V) at the test points shown below. If any voltage is incorrect, there may be a hardware fault with the module. Replace the module or repair the hardware. If all checks are normal, please contact our technical support for assistance.
No broadcast after successful firmware programming:
If this issue occurs, please check the following:
- Confirm the firmware is compatible with the board.
- Verify the speaker is properly connected and power is supplied correctly. Use an oscilloscope to measure the audio output test points on the main chip. If there is no output, check if the firmware is correct. If there is output but no sound, check for soldering issues with the audio amplifier on the module. Replace the audio amplifier if necessary and retest. The measurement points are shown below. If all checks are normal, please contact our technical support for assistance.
With broadcast but command words are not recognized after programming:
- Check the microphone and connector connections.
- Verify the microphone polarity matches the markings on the module board.
- Use a multimeter to measure the MICBIAS pin voltage (should be around 2.8V). Use an oscilloscope to check for audio input waveform at the microphone input pins (set oscilloscope to 100mV/div). If the signal is normal but recognition fails, check the firmware. If the signal is abnormal, inspect the board for physical damage. The measurement points are shown below. If all checks are normal, please contact our technical support for assistance.
Additional Application Notes¶
Since the CI23161 and CI23162 chips have high ESD protection ratings and the module is designed for easy user expansion, no additional ESD protection devices are included on the module. For applications requiring higher ESD protection, additional ESD protection devices can be added. It is recommended to wear anti-static wrist straps, gloves, or finger cots during inspection and soldering processes. Reserve space for ESD protection devices at the corresponding connector positions on the main board to ensure product quality and reliability.
When using the module, ensure correct connections for the microphone, speaker, and power/UART interfaces, and prevent short circuits at the test points on the back of the module.
Note that the module’s UART interface operates at 5V logic levels. Use a 5V-compatible UART for communication. For software debugging, a USB-to-UART adapter can be used. Add UART print commands at appropriate locations in the SDK software, compile the firmware, program it to the module, and then perform debugging and verification.
Production Guide, Storage, and Ordering Information¶
Production Guide¶
The module features an integrated connector interface for easy production. Simply insert the microphone, speaker, and power/communication connectors into their respective terminals. The board is designed with foolproof connectors to prevent incorrect connections. During assembly, wear anti-static gloves and wrist straps, and apply appropriate force to ensure proper connector engagement. Open the vacuum anti-static packaging only when ready to begin assembly.
Storage Conditions¶
The module is vacuum-sealed and has minimal storage requirements. It can be stored in a non-condensing environment below 40°C/90% RH. The module’s Moisture Sensitivity Level (MSL) is Level 3. After opening the vacuum-sealed bag or if the bag is compromised, handle the module according to MSL Level 3 requirements.
Packaging and Ordering Information¶
| Product Model | Packaging Method | Modules per Tray | Modules per Package | Modules per Carton |
|---|---|---|---|---|
| CI-G161GS02J | Tray + Anti-static Bag + Carton | 40pcs | 10 trays (400pcs) | 3 packages (1200pcs) |
| CI-G162GS02J | Tray + Anti-static Bag + Carton | 40pcs | 10 trays (400pcs) | 3 packages (1200pcs) |
Purchasing and Technical Support¶
To purchase samples of our products, please visit ☞Sample Purchase.
For technical support, please log in to ☞Chipintelli AI Speech Development Platform.